Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Low Temperature Soldering: Thermal Cycling Reliability Performance
The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. Eutectic Sn-Bi alloy is usu
.. read more
Study of the Growth of Sn-Cu Intermetallic Compounds Using XRF Coulometric Stripping (XRF-CS) Method
The method to measure intermetallic compound layer thickness is discussed in a paper recently published by the author[1]. The method uses voltage/current sources, voltmeters, and electrolyte
.. read more
Acceptance Testing of Low-Ag Reflow Solder Alloys
Since the implementation of the European Union RoHS directive in 2006,the electronics industry has seen an expansion of available low-silver lead (Pb)-free alloys for wave soldering,miniwave re
.. read more
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish
In this paper,we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints
on the central pad of two different packages – QFN and an Agilent package
.. read more
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. read more
The Elimination of Whiskers from Electroplated Tin
After the implementation of RoHS and the discontinued use of lead bearing products and the introduction of lead free (LF)
solders,tin and its alloys have come to the forefront as the first choi
.. read more
Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. read more
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more
Low Temperature Soldering: Thermal Cycling Reliability Performance
The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. Eutectic Sn-Bi alloy is usu
.. read more
Study of the Growth of Sn-Cu Intermetallic Compounds Using XRF Coulometric Stripping (XRF-CS) Method
The method to measure intermetallic compound layer thickness is discussed in a paper recently published by the author[1]. The method uses voltage/current sources, voltmeters, and electrolyte
.. read more
Acceptance Testing of Low-Ag Reflow Solder Alloys
Since the implementation of the European Union RoHS directive in 2006,the electronics industry has seen an expansion of available low-silver lead (Pb)-free alloys for wave soldering,miniwave re
.. read more
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish
In this paper,we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints
on the central pad of two different packages – QFN and an Agilent package
.. read more
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. read more
The Elimination of Whiskers from Electroplated Tin
After the implementation of RoHS and the discontinued use of lead bearing products and the introduction of lead free (LF)
solders,tin and its alloys have come to the forefront as the first choi
.. read more
Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. read more
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more