Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Soldering Immersion Tin
The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before. Immersion tin with its associated attributes,is well placed to fulfill the r
.. read more
Method to Measure Intermetallic Layer Thickness and Its Application to Develop a New Equation to Predict Its Growth
Lead Free Technology has brought new materials and different quality concerns to the Electronics Industry. For that,the creation of new methods to determine the quality of materials is needed a
.. read more
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. read more
The Impact of Converting Flex Circuits From HASL to a RoHS Compliant Surface Finishes
This paper will explore the most common alternatives to hot air-leveled solder (HASL) as a finish for flex circuits and some of the issues one may want to be aware of when converting. Whether t
.. read more
Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since July 1st 2006,the 2002/95/EC RoHS European directive has forced the electronic industry to switch from Tin-Lead to lead-free soldering alloys for components assembly.
Exemption domains ha
.. read more
Yet More Analysis from the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The data from the IPC Alternate Finishes Task Group Report “Time,Temperature and Humidity Stress for Final Finish Board Solderability” has been analyzed in a greater depth than in the actual re
.. read more
Reflow Defects with Lead-Free Soldering Moisture Sensitive Components
Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav
.. read more
iNEMI Recommendations on Lead Free Finishes for Components Used in High-Reliability Products
This document is intended to help manufacturers minimize the risk of failures from tin whiskers. It is the consensus of the
iNEMI User Group that pure tin electroplating presents a risk in high
.. read more
Achieving Sn/Pb Void Performance Utilizing Lead Free Solder Pastes
One of the reported problems in moving to lead free has been increased solder voiding. Current research indicates that paste
formulation,reflow profile and board finish,when selected carefully,
.. read more
A Study of Implementing Lead free Soldering Process with Organic Solderability Preservative Coating In a High Volume Production Environment
As the global electronic industry marches toward the brave new world of environmentally conscious electronic manufacturing,lead free soldering has made some fundamental shifts in the processing
.. read more
Further Analysis of the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The IPC study mentioned in the title looked at the effects of time,temperature and humidity on the solderability of true bare copper,immersion silver,immersion tin,organic soldering preservativ
.. read more
Immersion Silver and Immersion Tin IPC Plating Committee 4-14 Industry Update
The development of two new industry specifications – IPC-4553 (immersion silver IAg) and IPC-4554 (immersion tin ISn)
are well under way. Following in a tradition started with the development o
.. read more
The Importance of Cooling Rate in the Developing the Totally Controlled Reflow Process for Lead Free and Eutectic Tin Lead...
The impact cooling rates exert on the reflow process is identified. The trends in shear strength and the
microstructural evolution of the solder joints are described. Lead free (Sn/3.5Ag/0.7Cu)
.. read more
Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder
The wetting of alternative PCB surface finishes,including immersion silver (I-Ag) and immersion tin (I-Sn),by
Sn/Ag/Cu solder and Sn/Pb solder,was studied in this work,along with electroless ni
.. read more
Next Generation Pb-free Immersion Finishes,Methodologies used to Determine Coating Thickness and the Impact of Thickness Variations and Rework on Soldering
The next generation of surface finish coatings to replace HASL are now being installed by various PWB manufacturers and have been implemented by many OEMs. Coating thickness requirements are p
.. read more
PWB Final Surface Treatment Process and Film Characteristics that Satisfy Lead-free Solder Mounting
Because of environmental concerns,elimination of lead from electronic components has been recently encouraged,and as a result,lead-free solders are frequently adopted for solder mounting. The O
.. read more
Soldering Immersion Tin
The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before. Immersion tin with its associated attributes,is well placed to fulfill the r
.. read more
Method to Measure Intermetallic Layer Thickness and Its Application to Develop a New Equation to Predict Its Growth
Lead Free Technology has brought new materials and different quality concerns to the Electronics Industry. For that,the creation of new methods to determine the quality of materials is needed a
.. read more
Creep Corrosion of OSP and ImAg PWB Finishes
With increasing adoption of lead-free PWB surface finishes,along with increasing product deployments in more corrosive
environments,the electronics industry is observing increased occurrences o
.. read more
The Impact of Converting Flex Circuits From HASL to a RoHS Compliant Surface Finishes
This paper will explore the most common alternatives to hot air-leveled solder (HASL) as a finish for flex circuits and some of the issues one may want to be aware of when converting. Whether t
.. read more
Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since July 1st 2006,the 2002/95/EC RoHS European directive has forced the electronic industry to switch from Tin-Lead to lead-free soldering alloys for components assembly.
Exemption domains ha
.. read more
Yet More Analysis from the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The data from the IPC Alternate Finishes Task Group Report “Time,Temperature and Humidity Stress for Final Finish Board Solderability” has been analyzed in a greater depth than in the actual re
.. read more
Reflow Defects with Lead-Free Soldering Moisture Sensitive Components
Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav
.. read more
iNEMI Recommendations on Lead Free Finishes for Components Used in High-Reliability Products
This document is intended to help manufacturers minimize the risk of failures from tin whiskers. It is the consensus of the
iNEMI User Group that pure tin electroplating presents a risk in high
.. read more
Achieving Sn/Pb Void Performance Utilizing Lead Free Solder Pastes
One of the reported problems in moving to lead free has been increased solder voiding. Current research indicates that paste
formulation,reflow profile and board finish,when selected carefully,
.. read more
A Study of Implementing Lead free Soldering Process with Organic Solderability Preservative Coating In a High Volume Production Environment
As the global electronic industry marches toward the brave new world of environmentally conscious electronic manufacturing,lead free soldering has made some fundamental shifts in the processing
.. read more
Further Analysis of the Alternate Finishes Task Group Report on Time,Temperature and Humidity Stress of Final Board Finish Solderability
The IPC study mentioned in the title looked at the effects of time,temperature and humidity on the solderability of true bare copper,immersion silver,immersion tin,organic soldering preservativ
.. read more
Immersion Silver and Immersion Tin IPC Plating Committee 4-14 Industry Update
The development of two new industry specifications – IPC-4553 (immersion silver IAg) and IPC-4554 (immersion tin ISn)
are well under way. Following in a tradition started with the development o
.. read more
The Importance of Cooling Rate in the Developing the Totally Controlled Reflow Process for Lead Free and Eutectic Tin Lead...
The impact cooling rates exert on the reflow process is identified. The trends in shear strength and the
microstructural evolution of the solder joints are described. Lead free (Sn/3.5Ag/0.7Cu)
.. read more
Wetting of Fresh and Aged Immersion Tin and Silver Surface Finishes by Sn/Ag/Cu Solder
The wetting of alternative PCB surface finishes,including immersion silver (I-Ag) and immersion tin (I-Sn),by
Sn/Ag/Cu solder and Sn/Pb solder,was studied in this work,along with electroless ni
.. read more
Next Generation Pb-free Immersion Finishes,Methodologies used to Determine Coating Thickness and the Impact of Thickness Variations and Rework on Soldering
The next generation of surface finish coatings to replace HASL are now being installed by various PWB manufacturers and have been implemented by many OEMs. Coating thickness requirements are p
.. read more
PWB Final Surface Treatment Process and Film Characteristics that Satisfy Lead-free Solder Mounting
Because of environmental concerns,elimination of lead from electronic components has been recently encouraged,and as a result,lead-free solders are frequently adopted for solder mounting. The O
.. read more