Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Design for Testability (DFT) to Overcome Functional Board Test Complexities in Manufacturing Test
Manufacturers test to ensure that the product is built correctly. Shorts,opens,wrong or incorrectly inserted components,even catastrophically faulty components need to be flagged,found and repa
.. read more
Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of Printed Circuit Board Assembly
This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a component/devices in a printed circuit board assembly
.. read more
A Study on Using Solid State Relay (SSR) in Automatic Test Equipment
Reed relay is widely used in Automatic Test Equipment (ATE) for its high speed,low cost and wide availabilities. However,being mechanical relays,they have their share of limitations and this pa
.. read more
Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been dras
.. read more
The Evolution of ICT: PCB Technologies,Test Philosophies,and Manufacturing Business Models Are Driving In-Circuit Test Evolution and Innovations
Many manufacturers employ one or more In-Circuit Test (ICT) systems in their PCB manufacturing facilities to help them detect manufacturing process and component defects. These “bed-of-nails” e
.. read more
Benefits and Limitations of Universal,low-pin count Automated Test Equipment for Printed Circuit Assemblies
This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit
Assembly (PCA) testing utilizing the test access port (TAP) defined in
.. read more
Improving SMT Yield with AOI and AXI Test Results Analysis
As printed circuit board assembly (PCBA) becomes more complex,Automatic Optical Inspection (AOI) and Automatic Xray Inspection (AXI) systems are becoming more widely used in electronics manufac
.. read more
The Socketless Revolution Larger Probes on Smaller Center Test Targets Application of the Socketless Probe Technology to PCB Manufacturing and...
As technology progresses,electronic components that do bigger and better things are hitting the market. At the same time,the size of the PCB is shrinking. While circuit board designers could re
.. read more
What to Consider when Designing a Universal Test Strategy Tool
Selecting an optimal test strategy is a complex task today. There are many test inspection and test methods available. The
most common choices to find manufacturing defects on printed circuit b
.. read more
In-Circuit Test Probe Contact on Lead Free Printed Circuit Board Assemblies
The in-circuit test (ICT) of printed circuit boards (PCBs) assembled with Lead Free solder was anticipated to be problematic
by industry test engineers,due to contact failures associated with t
.. read more
The Integration of Third-Party Boundary-Scan Products into Customer Preferred Test Platforms has Become and Attractive Cost Effective Test Solution
In today’s complex manufacturing test environments,it is becoming increasingly difficult to detect and diagnose structural
faults within highly complex multi-layer PCB designs that offer extrem
.. read more
Issues and Challenges of Testing Modern Low Voltage Devices with Conventional In-Circuit Testers
The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device
manufacturers have moved to satisfy market demands for more powerful products,sma
.. read more
Test and Inspection of Lead-Free Assemblies
Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes.
While some companies are taking advantage of the situation and are us
.. read more
Design for Testability (DFT) to Overcome Functional Board Test Complexities in Manufacturing Test
Manufacturers test to ensure that the product is built correctly. Shorts,opens,wrong or incorrectly inserted components,even catastrophically faulty components need to be flagged,found and repa
.. read more
Expanding IEEE Std 1149.1 Boundary-Scan Architecture Beyond Manufacturing Test of Printed Circuit Board Assembly
This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a component/devices in a printed circuit board assembly
.. read more
A Study on Using Solid State Relay (SSR) in Automatic Test Equipment
Reed relay is widely used in Automatic Test Equipment (ATE) for its high speed,low cost and wide availabilities. However,being mechanical relays,they have their share of limitations and this pa
.. read more
Implementing Robust Bead Probe Test Processes into Standard Pb-Free Assembly
Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been dras
.. read more
The Evolution of ICT: PCB Technologies,Test Philosophies,and Manufacturing Business Models Are Driving In-Circuit Test Evolution and Innovations
Many manufacturers employ one or more In-Circuit Test (ICT) systems in their PCB manufacturing facilities to help them detect manufacturing process and component defects. These “bed-of-nails” e
.. read more
Benefits and Limitations of Universal,low-pin count Automated Test Equipment for Printed Circuit Assemblies
This paper discusses the benefits and limitations of universal,low-pin count Automated Test Equipment for Printed Circuit
Assembly (PCA) testing utilizing the test access port (TAP) defined in
.. read more
Improving SMT Yield with AOI and AXI Test Results Analysis
As printed circuit board assembly (PCBA) becomes more complex,Automatic Optical Inspection (AOI) and Automatic Xray Inspection (AXI) systems are becoming more widely used in electronics manufac
.. read more
The Socketless Revolution Larger Probes on Smaller Center Test Targets Application of the Socketless Probe Technology to PCB Manufacturing and...
As technology progresses,electronic components that do bigger and better things are hitting the market. At the same time,the size of the PCB is shrinking. While circuit board designers could re
.. read more
What to Consider when Designing a Universal Test Strategy Tool
Selecting an optimal test strategy is a complex task today. There are many test inspection and test methods available. The
most common choices to find manufacturing defects on printed circuit b
.. read more
In-Circuit Test Probe Contact on Lead Free Printed Circuit Board Assemblies
The in-circuit test (ICT) of printed circuit boards (PCBs) assembled with Lead Free solder was anticipated to be problematic
by industry test engineers,due to contact failures associated with t
.. read more
The Integration of Third-Party Boundary-Scan Products into Customer Preferred Test Platforms has Become and Attractive Cost Effective Test Solution
In today’s complex manufacturing test environments,it is becoming increasingly difficult to detect and diagnose structural
faults within highly complex multi-layer PCB designs that offer extrem
.. read more
Issues and Challenges of Testing Modern Low Voltage Devices with Conventional In-Circuit Testers
The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device
manufacturers have moved to satisfy market demands for more powerful products,sma
.. read more
Test and Inspection of Lead-Free Assemblies
Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes.
While some companies are taking advantage of the situation and are us
.. read more