Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Integrating Functional High-Speed Testing into the Structural Testing Process in Manufacturing

Mainstream manufacturing testing strategies involve structural tests including optical inspection, structural defect finding, such as opens, shorts, missing and catastrophically defective co .. read more

HDI Training & Implementation at Eagle Test Systems

Eagle Test Systems (ETS) a Teradyne Company established a team during 2009 to develop a training exercise that would bring High Density Interconnect (HDI) knowledge to new products. A digital m .. read more

A Flexible Fixturing System for In-Circuit Test of High Node Count Circuit Boards

Large printed wiring assemblies (PWB) exceeding 7000 circuit nets create significant quality,cycle time and cost issues at structural test in the new product introduction (NPI) phase. Tradition .. read more

An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics

As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us .. read more

ICT Probe Penetrability of Solder Paste Flux Residues with a Vacuum-Actuated Fixture

All but the most simple circuit boards processed in recent times are inspected using in-circuit testing,ICT. In order to test on pads or connections printed with no-clean solder paste; the post .. read more

Solving Today’s Test Challenges: Razor Sharp Probes

Due to In-Circuit Test issues probing difficult to penetrate processes such as Pb-free solder,OSP (Organic Solderability Preservative),Immersion Au (Gold),Ag (Silver),Sn (Tin) and No-Clean,as w .. read more

Results from 2007 Industry Defect Level and Test Effectiveness Studies

To select an optimal test strategy,good knowledge of defect levels and test effectiveness are two very important factors to include. In 1999 an industry defect level study was completed and was .. read more

Integrating Functional High-Speed Testing into the Structural Testing Process in Manufacturing

Mainstream manufacturing testing strategies involve structural tests including optical inspection, structural defect finding, such as opens, shorts, missing and catastrophically defective co .. read more

HDI Training & Implementation at Eagle Test Systems

Eagle Test Systems (ETS) a Teradyne Company established a team during 2009 to develop a training exercise that would bring High Density Interconnect (HDI) knowledge to new products. A digital m .. read more

A Flexible Fixturing System for In-Circuit Test of High Node Count Circuit Boards

Large printed wiring assemblies (PWB) exceeding 7000 circuit nets create significant quality,cycle time and cost issues at structural test in the new product introduction (NPI) phase. Tradition .. read more

An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics

As people become more concerned about the global outbreaks of various strains of influenza,more precautions are being taken with respect to personal hygiene. A common precaution involves the us .. read more

ICT Probe Penetrability of Solder Paste Flux Residues with a Vacuum-Actuated Fixture

All but the most simple circuit boards processed in recent times are inspected using in-circuit testing,ICT. In order to test on pads or connections printed with no-clean solder paste; the post .. read more

Solving Today’s Test Challenges: Razor Sharp Probes

Due to In-Circuit Test issues probing difficult to penetrate processes such as Pb-free solder,OSP (Organic Solderability Preservative),Immersion Au (Gold),Ag (Silver),Sn (Tin) and No-Clean,as w .. read more

Results from 2007 Industry Defect Level and Test Effectiveness Studies

To select an optimal test strategy,good knowledge of defect levels and test effectiveness are two very important factors to include. In 1999 an industry defect level study was completed and was .. read more