Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Failure Analysis of High-Speed Cables Due to Molecular Degradation of Wire Insulation
Server hardware is often interconnected with high-speed, insulated copper cables to transfer data several meters or more between other servers, network hardware, and storage devices within d
.. read more
Novel Surface Finish for 5G-mmWave frequency PCB Technologies- How to Achieve Optimum Signal Integrity
The next generation devices using high frequency of 5G to mmWave and greater has called for innovation in materials used in electronics manufacturing to realize the optimum signal integrity
.. read more
Insertion Loss Investigation Using a Non-Oxide Alkaline Surface Treatment for Inner-Layer Copper
The industry is moving toward using exotic dielectric materials with a very low loss tangent to improve insertion loss performance. This leads to the result that the signal loss attenuation
.. read more
Evaluating Solder Joint Failures and Solder Joint Reliability: A Side-by-Side Comparison of Direct Current and Microwave Based Monitoring Techniques
Historically, evaluations of solder joint failures and solder joint reliability have been done with direct current (DC) methods, using event detectors or data loggers for high-frequency circ
.. read more
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. read more
High Frequency RF Electrical Performance Effects of Plated through Hole Vias
Plated Though Hole (PTH) vias are common in the PCB industry,however their impact on electrical performance can sometimes be unclear. The confusion can be due to several different issues. Some
.. read more
A Signal Integrity Measuring Methodology in the Extraction of Wide Bandwidth Environmental Coefficients
In technology tendency,signal integrity performance gets more critical upon today’s higher signal transmission speed and quantity demand in every field of applications such as computer CPU and
.. read more
The Effect of Radiation Losses on High Frequency PCB Performance
This paper is an extension of an IPC paper [1] presented last year which addressed microwave insertion loss of common PCB transmission line circuits. Insertion loss of these circuits is made up
.. read more
Insertion Loss Reduction through Non-Roughening Inner-Layer Surface Treatments
As channel speeds approach 25 Gbps,near the expected maximum bandwidth for traditional copper-based PCBs,every available tool to minimize total insertion loss in the board material system will
.. read more
Insertion Loss Comparisons of Common High Frequency PCB Constructions
Printed Circuit Boards (PCB’s) have been used for many years in low loss,high frequency microwave applications and many of these circuits have become increasingly complex. Often these complex c
.. read more
Influence of Via Stub Length and Antipad Size on the Insertion Loss Profile
The growing transmission speed and volume of digital content increases the pressure on reduction of overall insertion loss of printed circuit boards permanently.
In today’s circuit boards,it is
.. read more
Cleaning in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. read more
New Developments in PCB Laminates
Executive Summary
There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC
.. read more
A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology
Signal integrity analysis has shown that printed circuit board (PCB) insertion loss is a key factor affecting high
speed channel performance. Determining and controlling PCB insertion loss have
.. read more
A Designed Experiment for the Influence of Copper Foils on Impedance,DC Line Resistance and Insertion Loss
For the last couple of years,the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently,the need to reduce insertion loss came
.. read more
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. read more
New Developments in PCB Laminates
There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be
.. read more
A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. read more
Manufacture and Performance of a Z-interconnect HDI Circuit Card
More and more circuit board designs require signals paths that can handle multi-gigahertz frequencies. The challenges for organic circuit boards,in meeting these electrical requirements,include
.. read more
Microwave Characteristics and Applications of Liquid Crystal Polymer Flex
We present the electrical characterization of our Liquid Crystal Polymer (LCP) at microwave and millimeter frequencies and the applications of LCP to circuit components. We use several methodol
.. read more
Development of Cleanliness Specification for Single - Mode Connectors
This paper summarizes research performed by the NEMI (National Electronics Manufacturing Initiative) Fiber Optic Signal
Performance Project team. The project focused on the development of a cle
.. read more
Insertion Loss,Eye Pattern and Crosstalk Analysis of Mixed Dielectric Striplines (Simulation and Measurement)
As digital data rates reach 5Gb/s,10Gb/s and beyond,digital designers are finding it increasingly difficult to meet their
design constraints using FR4. While there are a host of alternative mat
.. read more
Failure Analysis of High-Speed Cables Due to Molecular Degradation of Wire Insulation
Server hardware is often interconnected with high-speed, insulated copper cables to transfer data several meters or more between other servers, network hardware, and storage devices within d
.. read more
Novel Surface Finish for 5G-mmWave frequency PCB Technologies- How to Achieve Optimum Signal Integrity
The next generation devices using high frequency of 5G to mmWave and greater has called for innovation in materials used in electronics manufacturing to realize the optimum signal integrity
.. read more
Insertion Loss Investigation Using a Non-Oxide Alkaline Surface Treatment for Inner-Layer Copper
The industry is moving toward using exotic dielectric materials with a very low loss tangent to improve insertion loss performance. This leads to the result that the signal loss attenuation
.. read more
Evaluating Solder Joint Failures and Solder Joint Reliability: A Side-by-Side Comparison of Direct Current and Microwave Based Monitoring Techniques
Historically, evaluations of solder joint failures and solder joint reliability have been done with direct current (DC) methods, using event detectors or data loggers for high-frequency circ
.. read more
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. read more
High Frequency RF Electrical Performance Effects of Plated through Hole Vias
Plated Though Hole (PTH) vias are common in the PCB industry,however their impact on electrical performance can sometimes be unclear. The confusion can be due to several different issues. Some
.. read more
A Signal Integrity Measuring Methodology in the Extraction of Wide Bandwidth Environmental Coefficients
In technology tendency,signal integrity performance gets more critical upon today’s higher signal transmission speed and quantity demand in every field of applications such as computer CPU and
.. read more
The Effect of Radiation Losses on High Frequency PCB Performance
This paper is an extension of an IPC paper [1] presented last year which addressed microwave insertion loss of common PCB transmission line circuits. Insertion loss of these circuits is made up
.. read more
Insertion Loss Reduction through Non-Roughening Inner-Layer Surface Treatments
As channel speeds approach 25 Gbps,near the expected maximum bandwidth for traditional copper-based PCBs,every available tool to minimize total insertion loss in the board material system will
.. read more
Insertion Loss Comparisons of Common High Frequency PCB Constructions
Printed Circuit Boards (PCB’s) have been used for many years in low loss,high frequency microwave applications and many of these circuits have become increasingly complex. Often these complex c
.. read more
Influence of Via Stub Length and Antipad Size on the Insertion Loss Profile
The growing transmission speed and volume of digital content increases the pressure on reduction of overall insertion loss of printed circuit boards permanently.
In today’s circuit boards,it is
.. read more
Cleaning in an HDI World
Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo
.. read more
New Developments in PCB Laminates
Executive Summary
There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC
.. read more
A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology
Signal integrity analysis has shown that printed circuit board (PCB) insertion loss is a key factor affecting high
speed channel performance. Determining and controlling PCB insertion loss have
.. read more
A Designed Experiment for the Influence of Copper Foils on Impedance,DC Line Resistance and Insertion Loss
For the last couple of years,the main concerns regarding the electrical performance of blank PCB boards were impedance and ohmic resistance. Just recently,the need to reduce insertion loss came
.. read more
Thermal Characteristics of PCB Laminates used in High Frequency Applications
As technology advances,understanding thermal management issues of high frequency PCB’s increases. There are many different aspects to consider for PCB thermal management. This paper will invest
.. read more
New Developments in PCB Laminates
There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be
.. read more
A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. read more
Manufacture and Performance of a Z-interconnect HDI Circuit Card
More and more circuit board designs require signals paths that can handle multi-gigahertz frequencies. The challenges for organic circuit boards,in meeting these electrical requirements,include
.. read more
Microwave Characteristics and Applications of Liquid Crystal Polymer Flex
We present the electrical characterization of our Liquid Crystal Polymer (LCP) at microwave and millimeter frequencies and the applications of LCP to circuit components. We use several methodol
.. read more
Development of Cleanliness Specification for Single - Mode Connectors
This paper summarizes research performed by the NEMI (National Electronics Manufacturing Initiative) Fiber Optic Signal
Performance Project team. The project focused on the development of a cle
.. read more
Insertion Loss,Eye Pattern and Crosstalk Analysis of Mixed Dielectric Striplines (Simulation and Measurement)
As digital data rates reach 5Gb/s,10Gb/s and beyond,digital designers are finding it increasingly difficult to meet their
design constraints using FR4. While there are a host of alternative mat
.. read more