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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Acid Copper Plating Process for IC Substrate Applications
Two challenges that advanced packaging suppliers are faced with during IC substrate fabrication are meeting the copper plating performance requirements and reducing manufacturing process cos
.. read more
Mixed Metal Oxide "MMO" Insoluble Anode System for Enhanced Operational Acid Copper Plating of Printed Wire Boards "PWB"
Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturabili
.. read more
Via Filling: Challenges for the Chemistry in the Plating Process
Copper filling of laser drilled blind micro vias (BMV´s) is now the standard production method for high density interconnects. Copper filled BMV´s are used as solder bump sites for IC packaging
.. read more
Production of Flexible Circuits in Reel to Reel Horizontal Production Systems
Reel to reel production of flexible circuits where the substrate consists of a continuous roll is a technique commonly used in mass production. This method is an obvious solution for efficient
.. read more
Successful Implementation of Insoluble Anodes in a Vertical Plating Acid Copper Tank at Electrotek Corporation in Oak Creek WI.
The use of an insoluble anode in place of standard copper anodes (slab or titanium baskets filled with copper) improves the quality of plating,increases the productivity of the plating line,red
.. read more
The Use of Insoluble,Mixed Metal Oxide Coated Titanium Anodes to Improve Quality and Decrease Plating Times for Circuit Boards
Copper plating in the printed circuit board industry has traditionally used soluble copper anodes in a vertical configuration. Newer,high speed,horizontal plating lines utilize insoluble anodes
.. read more
Acid Copper Plating Process for IC Substrate Applications
Two challenges that advanced packaging suppliers are faced with during IC substrate fabrication are meeting the copper plating performance requirements and reducing manufacturing process cos
.. read more
Mixed Metal Oxide "MMO" Insoluble Anode System for Enhanced Operational Acid Copper Plating of Printed Wire Boards "PWB"
Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturabili
.. read more
Via Filling: Challenges for the Chemistry in the Plating Process
Copper filling of laser drilled blind micro vias (BMV´s) is now the standard production method for high density interconnects. Copper filled BMV´s are used as solder bump sites for IC packaging
.. read more
Production of Flexible Circuits in Reel to Reel Horizontal Production Systems
Reel to reel production of flexible circuits where the substrate consists of a continuous roll is a technique commonly used in mass production. This method is an obvious solution for efficient
.. read more
Successful Implementation of Insoluble Anodes in a Vertical Plating Acid Copper Tank at Electrotek Corporation in Oak Creek WI.
The use of an insoluble anode in place of standard copper anodes (slab or titanium baskets filled with copper) improves the quality of plating,increases the productivity of the plating line,red
.. read more
The Use of Insoluble,Mixed Metal Oxide Coated Titanium Anodes to Improve Quality and Decrease Plating Times for Circuit Boards
Copper plating in the printed circuit board industry has traditionally used soluble copper anodes in a vertical configuration. Newer,high speed,horizontal plating lines utilize insoluble anodes
.. read more