Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Inspection and Failure Analysis of BTCs (Bottom Termination Components
On August 30, 2023, IPC hosted a webinar titled "Inspection and Failure Analysis of Bottom Termination Components", presented by William Graver. The session delved into the challenges associ
.. read more
Reliability of CCGA and PBGA Assemblies
Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now
starting to be implemented for use in military and aerospace application
.. read more
A Simpler Approach to Cost-Effective Solder Paste Testing
The increasing demand for portable electronic
products has accelerated the quest for even greater
miniaturization. At the current state of electronic
production technology,volume and weight
red
.. read more
Finally! Practical Guidelines for Achieving Successful Lead-Free Assembly
With the Waste Electrical and Electronic Equipment
(WEEE) Directive in Europe outlawing lead from
many electronic devices produced and imported in
the EU by July 2006,as well as with foreign
co
.. read more
Biologically Inspired Vision Makes for Smarter PCBA Manufacturing Technology - New Technologies Overcome Fundamental Limitations of Conventional Optical Inspection Methods
For test engineers and managers,automated optical
inspection (AOI) systems have emerged as a
countermeasure to the growing threats of lost
physical or electrical access to assembled PCB. AOI
sy
.. read more
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. read more
Inspection and Failure Analysis of BTCs (Bottom Termination Components
On August 30, 2023, IPC hosted a webinar titled "Inspection and Failure Analysis of Bottom Termination Components", presented by William Graver. The session delved into the challenges associ
.. read more
Reliability of CCGA and PBGA Assemblies
Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now
starting to be implemented for use in military and aerospace application
.. read more
A Simpler Approach to Cost-Effective Solder Paste Testing
The increasing demand for portable electronic
products has accelerated the quest for even greater
miniaturization. At the current state of electronic
production technology,volume and weight
red
.. read more
Finally! Practical Guidelines for Achieving Successful Lead-Free Assembly
With the Waste Electrical and Electronic Equipment
(WEEE) Directive in Europe outlawing lead from
many electronic devices produced and imported in
the EU by July 2006,as well as with foreign
co
.. read more
Biologically Inspired Vision Makes for Smarter PCBA Manufacturing Technology - New Technologies Overcome Fundamental Limitations of Conventional Optical Inspection Methods
For test engineers and managers,automated optical
inspection (AOI) systems have emerged as a
countermeasure to the growing threats of lost
physical or electrical access to assembled PCB. AOI
sy
.. read more
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. read more