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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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An Evaluation of the Insulation Resistance and Surface Contamination of Printed Circuit Board Assemblies
The overall effectiveness of 20 circuit board assembly processes,made up of 4 solder/flux combinations and 6 cleaning processes was investigated by using in-situ surface insulation resistance m
.. read more
Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing
High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur
.. read more
Effect of Environmental Stress and Bias Conditions on Reliability of Embedded Planar Capacitors
The reliability of an embedded planar capacitor laminate under a variety of environmental stress and bias conditions was investigated. The dielectric consisted of a composite of BaTiO3 particle
.. read more
The Evaluation of CAF property for narrow TH pitch PCBs
Conductive Anodic Filament(CAF) that is one of the copper migration phenomena becomes significant problem with higher density circuit for printed circuit board.(PCB) In the past CAF property wa
.. read more
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. read more
Parylene as a Suppressant for Tin Whiskers Growth on Printed Circuit Boards
With the implementation of RoHS directives,pure tin plating is replacing lead in the tin-alloy used in the printed circuit boards and other worldwide electronics. Although use of tin provides a
.. read more
Design for Manufacture – Ceramic Thick-Film Embedded Capacitors
Embedding discrete capacitors right into printed circuit boards (PWB),although not new,is part of a pivotal technology for
the PWB industry. For example,the ability to locate decoupling capacit
.. read more
Development of the High Thermal Conduction Laminates for Large Current Board
With the objective of developing high thermal conductive laminates capable of being used as high current-carrying wiring
boards for automotive and industrial applications,we identified the opti
.. read more
Insulation Material for Next Generation Packaging Substrates
With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor
devices are required to cope with finer patterning and higher wiring densi
.. read more
Selection of a Low VOC Conformal Coating
Boeing Commercial Electronics (BCE),a subsidiary of The Boeing Company,is a leading supplier of avionics and
cabin management systems for the Boeing family of commercial airplanes. Boeing speci
.. read more
An Evaluation of the Insulation Resistance and Surface Contamination of Printed Circuit Board Assemblies
The overall effectiveness of 20 circuit board assembly processes,made up of 4 solder/flux combinations and 6 cleaning processes was investigated by using in-situ surface insulation resistance m
.. read more
Failure Mechanisms in Embedded Planar Capacitors during High Temperature Operating Life (HTOL) Testing
High temperature operating life (HTOL) testing was performed on embedded planar capacitors (with epoxy- BaTiO3 composite dielectric) by subjecting these devices to highly accelerated temperatur
.. read more
Effect of Environmental Stress and Bias Conditions on Reliability of Embedded Planar Capacitors
The reliability of an embedded planar capacitor laminate under a variety of environmental stress and bias conditions was investigated. The dielectric consisted of a composite of BaTiO3 particle
.. read more
The Evaluation of CAF property for narrow TH pitch PCBs
Conductive Anodic Filament(CAF) that is one of the copper migration phenomena becomes significant problem with higher density circuit for printed circuit board.(PCB) In the past CAF property wa
.. read more
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. read more
Parylene as a Suppressant for Tin Whiskers Growth on Printed Circuit Boards
With the implementation of RoHS directives,pure tin plating is replacing lead in the tin-alloy used in the printed circuit boards and other worldwide electronics. Although use of tin provides a
.. read more
Design for Manufacture – Ceramic Thick-Film Embedded Capacitors
Embedding discrete capacitors right into printed circuit boards (PWB),although not new,is part of a pivotal technology for
the PWB industry. For example,the ability to locate decoupling capacit
.. read more
Development of the High Thermal Conduction Laminates for Large Current Board
With the objective of developing high thermal conductive laminates capable of being used as high current-carrying wiring
boards for automotive and industrial applications,we identified the opti
.. read more
Insulation Material for Next Generation Packaging Substrates
With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor
devices are required to cope with finer patterning and higher wiring densi
.. read more
Selection of a Low VOC Conformal Coating
Boeing Commercial Electronics (BCE),a subsidiary of The Boeing Company,is a leading supplier of avionics and
cabin management systems for the Boeing family of commercial airplanes. Boeing speci
.. read more