Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Cost Comparison of Complex PCB fabrication Using Traditional Sequential Lamination Methods versus Interconnect with Conductive Paste
As feature sizes are driven to be smaller,the cost of PCB fabrication is driven higher. In particular,sequential lamination of complex circuit boards is a time consuming and expensive process.
.. read more
Building Reliability into the PWB: Optimization of the Desmear and Metalization Processes for Use on High Frequency and Lead Free...
High Frequency and Lead-Free laminate materials are finding increased use in the PWB fabrication industry driven by end
user requirements for high-speed signal transmission and lead-free solder
.. read more
Flip Chip Processing Solutions as used in System in Package Applications
Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such
.. read more
Aerosol-Based Direct Writing of Interconnects
Optomec is developing an aerosol-based technology for high-precision,maskless deposition of a wide variety of
materials. The system functions by atomizing commercial inks and pastes,and then de
.. read more
Copper Surface Treatment and Plating Reliability
Reliable copper interconnects are a primary requirement for most printed wiring board applications. A variety of
wet manufacturing processes play an important role in the formation of durable i
.. read more
Advanced Conductive Adhesive for Interconnect of Solder/Sn-Terminated Components in Flexible Circuitry: A Case Study
Solder is used in polyimide-based flexible circuits for interconnect applications. But it cannot be used with polyester
and epoxy based substrates because of the low temperature tolerance of th
.. read more
Cost Comparison of Complex PCB fabrication Using Traditional Sequential Lamination Methods versus Interconnect with Conductive Paste
As feature sizes are driven to be smaller,the cost of PCB fabrication is driven higher. In particular,sequential lamination of complex circuit boards is a time consuming and expensive process.
.. read more
Building Reliability into the PWB: Optimization of the Desmear and Metalization Processes for Use on High Frequency and Lead Free...
High Frequency and Lead-Free laminate materials are finding increased use in the PWB fabrication industry driven by end
user requirements for high-speed signal transmission and lead-free solder
.. read more
Flip Chip Processing Solutions as used in System in Package Applications
Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics
industries. Changes that demand common and pervasive requirements for active assemblies such
.. read more
Aerosol-Based Direct Writing of Interconnects
Optomec is developing an aerosol-based technology for high-precision,maskless deposition of a wide variety of
materials. The system functions by atomizing commercial inks and pastes,and then de
.. read more
Copper Surface Treatment and Plating Reliability
Reliable copper interconnects are a primary requirement for most printed wiring board applications. A variety of
wet manufacturing processes play an important role in the formation of durable i
.. read more
Advanced Conductive Adhesive for Interconnect of Solder/Sn-Terminated Components in Flexible Circuitry: A Case Study
Solder is used in polyimide-based flexible circuits for interconnect applications. But it cannot be used with polyester
and epoxy based substrates because of the low temperature tolerance of th
.. read more