Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Reliability Impact of Frequent Power Cycles on Base Printed Wiring Boards High Density Packaging User Group (HDP)
The High Density Packaging (HDP) user group has completed a project to evaluate the impact on field reliability of more frequent thermal cycling over more narrow operating temperature ranges
.. read more
Effects of Dielectric Material,Aspect Ratio and Copper Plating on Microvia Reliability
This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp
.. read more
Behavior of Materials in the Manufacturing Environment
This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was
.. read more
High Density Packaging User Group – Pb-free Materials 2 Project Materials Testing of PWB Substrates to Establish Variability of Construction,...
An important element of the High Density Packaging Users Group (HDPUG) Consortium investigation into the reliability of printed wiring board (PWB) constructed with 20 different Pb-free mater
.. read more
Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning
The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring
.. read more
Use of Lead-Free Laminate DMA and TMA Data to Develop Stress versus Temperature Relationships for Predicting Plated Hole Reliability
Accelerated testing of plated hole life is necessary for economic reasons due to the long time to failure during field operating conditions. One difficulty in performing accelerated testing on
.. read more
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. read more
FLAT-WRAP™ A Novel Approach to Copper Wrap Plate
Copper Wrap Plate as specified in IPC 6012B table 3-2,is a requirement developed to enhance reliability for PCB’s designed with via structures that require planarization and surface capping. PC
.. read more
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. read more
Advances in Plating Technology: Reliable High Aspect Ratio’s
The Semiconductor industry is demanding more and more from today’s PWB manufacturers. This paper offers some insights to the needs,requirements,solutions and process verifications that R&D Circ
.. read more
New Methods to Efficiently Test the Reliability of Plated Vias and to Model Plated Via Life from Laminate Material Data
This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and
.. read more
Predicting Plated Through Hole Life at Assembly and in the Field from Thermal Stress Data
Over the past ten years,two new test methods: Interconnect Stress Test [1] and Highly Accelerated Thermal Shock [2] have
been developed to perform thermal cycling testing and in particular,to m
.. read more
Thermal Stress Testing & Impact of High Thermal Excursion Pre-Conditioning on Cycles to Fail
Today both Interconnect Stress Test (IST) and Highly Accelerated Thermal Shock (HATS) test methods are used to measure
plated through hole via reliability. Both of these test methods have prove
.. read more
New Laminates for High Reliability Printed Circuit Boards
The challenges for today’s PCBs are many,including higher assembly temperatures and higher device heat transfer
temperatures; faster clock cycles and higher bandwidths; higher component density
.. read more
Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...
The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the
electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S
.. read more
An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. Solders containing lead have
been the standard in printed circuit assembly processes. Lead-free sol
.. read more
Characterization of PCB Plated-Thru-Hole Reliability using Statistical Analysis
Various test methods are used to characterize the PCB plated-thru-hole reliability. One such method is the Interconnect Stress
Test (IST). The results from this test are often used to qualify P
.. read more
Reliability Impact of Frequent Power Cycles on Base Printed Wiring Boards High Density Packaging User Group (HDP)
The High Density Packaging (HDP) user group has completed a project to evaluate the impact on field reliability of more frequent thermal cycling over more narrow operating temperature ranges
.. read more
Effects of Dielectric Material,Aspect Ratio and Copper Plating on Microvia Reliability
This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp
.. read more
Behavior of Materials in the Manufacturing Environment
This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was
.. read more
High Density Packaging User Group – Pb-free Materials 2 Project Materials Testing of PWB Substrates to Establish Variability of Construction,...
An important element of the High Density Packaging Users Group (HDPUG) Consortium investigation into the reliability of printed wiring board (PWB) constructed with 20 different Pb-free mater
.. read more
Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning
The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring
.. read more
Use of Lead-Free Laminate DMA and TMA Data to Develop Stress versus Temperature Relationships for Predicting Plated Hole Reliability
Accelerated testing of plated hole life is necessary for economic reasons due to the long time to failure during field operating conditions. One difficulty in performing accelerated testing on
.. read more
A Novel Halogen-Free Material for High Speed PCB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. read more
FLAT-WRAP™ A Novel Approach to Copper Wrap Plate
Copper Wrap Plate as specified in IPC 6012B table 3-2,is a requirement developed to enhance reliability for PCB’s designed with via structures that require planarization and surface capping. PC
.. read more
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. read more
Advances in Plating Technology: Reliable High Aspect Ratio’s
The Semiconductor industry is demanding more and more from today’s PWB manufacturers. This paper offers some insights to the needs,requirements,solutions and process verifications that R&D Circ
.. read more
New Methods to Efficiently Test the Reliability of Plated Vias and to Model Plated Via Life from Laminate Material Data
This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and
.. read more
Predicting Plated Through Hole Life at Assembly and in the Field from Thermal Stress Data
Over the past ten years,two new test methods: Interconnect Stress Test [1] and Highly Accelerated Thermal Shock [2] have
been developed to perform thermal cycling testing and in particular,to m
.. read more
Thermal Stress Testing & Impact of High Thermal Excursion Pre-Conditioning on Cycles to Fail
Today both Interconnect Stress Test (IST) and Highly Accelerated Thermal Shock (HATS) test methods are used to measure
plated through hole via reliability. Both of these test methods have prove
.. read more
New Laminates for High Reliability Printed Circuit Boards
The challenges for today’s PCBs are many,including higher assembly temperatures and higher device heat transfer
temperatures; faster clock cycles and higher bandwidths; higher component density
.. read more
Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...
The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the
electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S
.. read more
An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability
Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. Solders containing lead have
been the standard in printed circuit assembly processes. Lead-free sol
.. read more
Characterization of PCB Plated-Thru-Hole Reliability using Statistical Analysis
Various test methods are used to characterize the PCB plated-thru-hole reliability. One such method is the Interconnect Stress
Test (IST). The results from this test are often used to qualify P
.. read more