Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
A Control-Chart Based Method for Solder Joint Crack Detection
Many researchers have used different failure criteria in the published solder joint reliability studies. Since the reported timeto-
failure would be different if different failure criteria were
.. read more
3-Dimensional Partitioning of Printed Circuit Design for High Speed Interconnections
When using standard approaches to PCB design and manufacture,there are a number of different elements that can impact
signal integrity at high data rates including: inconsistencies in dielectri
.. read more
Real Life Applications of Nanotechnology in Electronics
Nanotechnology is receiving a lot of attention from companies,universities and governments. The US $3.8million National
Nanotechnology Initiative is matched by initiatives in Europe and Asia. B
.. read more
Investigation of the Effectiveness of Automated X-ray Inspection Systems in a High Volume – Low Mix SMT Line
The advent of miniature surface mount components coupled with increasing lead counts has posed tremendous
challenges during assembly. This is especially true in an Electronics Manufacturing Ser
.. read more
BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. read more
A Control-Chart Based Method for Solder Joint Crack Detection
Many researchers have used different failure criteria in the published solder joint reliability studies. Since the reported timeto-
failure would be different if different failure criteria were
.. read more
3-Dimensional Partitioning of Printed Circuit Design for High Speed Interconnections
When using standard approaches to PCB design and manufacture,there are a number of different elements that can impact
signal integrity at high data rates including: inconsistencies in dielectri
.. read more
Real Life Applications of Nanotechnology in Electronics
Nanotechnology is receiving a lot of attention from companies,universities and governments. The US $3.8million National
Nanotechnology Initiative is matched by initiatives in Europe and Asia. B
.. read more
Investigation of the Effectiveness of Automated X-ray Inspection Systems in a High Volume – Low Mix SMT Line
The advent of miniature surface mount components coupled with increasing lead counts has posed tremendous
challenges during assembly. This is especially true in an Electronics Manufacturing Ser
.. read more
BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. read more