Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Study of the Growth of Sn-Cu Intermetallic Compounds Using XRF Coulometric Stripping (XRF-CS) Method
The method to measure intermetallic compound layer thickness is discussed in a paper recently published by the author[1]. The method uses voltage/current sources, voltmeters, and electrolyte
.. read more
Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo
.. read more
Failure Modes in Wire bonded and Flip Chip Packages
The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly proce
.. read more
Choosing a Low-Cost Alternative to Sac Alloys for PCB Assembly
Developing low-cost alternatives to near-eutectic SAC alloys for Pb-free assembly is crucial to continue producing affordable electronics products. Metals prices,especially silver,have been on
.. read more
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC)
failures under excessive PCB bending. Pad cratering cracks are not d
.. read more
A Plasma Deposited Surface Finish for Printed Circuit Boards
This paper will discuss a new approach to the final finishing for the PCB industry which is based on the use of an ultra-thin
fluoropolymer film as a protective coating to preserve solderabilit
.. read more
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. read more
How to Manage Wave Solder Alloy Contaminations
European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig
.. read more
The Elimination of Whiskers from Electroplated Tin
After the implementation of RoHS and the discontinued use of lead bearing products and the introduction of lead free (LF)
solders,tin and its alloys have come to the forefront as the first choi
.. read more
Effect of Gold Content on the Reliability of SnAgCu Solder Joints
Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for component leads,especially wire-bondable high frequency packages,where the gold thickness requirement for wi
.. read more
Solder Charge Grid Array: Advancements in the Technology of Surface Mount Area Array Solder Joint Attachment
Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package mi
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more
Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. read more
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. read more
A Study of Solder Optimization Development for Portable Electronic Device
With increasing use of portable appliances such as PDA and cellular phone,changing environment of application requires higher solder joint reliability. The Cu-OSP process has been widely used f
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more
Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. read more
A Study of Reliability between Solder Alloy and Pad Materials
The low Ag solder alloy shows higher drop performance than the high Ag solder alloy in the every kind of package and board combinations. This is related to the ductility of solder and the surfa
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. read more
A Compliant and Creep Resistant SAC-Al(Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. read more
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. read more
Study of the Growth of Sn-Cu Intermetallic Compounds Using XRF Coulometric Stripping (XRF-CS) Method
The method to measure intermetallic compound layer thickness is discussed in a paper recently published by the author[1]. The method uses voltage/current sources, voltmeters, and electrolyte
.. read more
Manufacturability and Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo
.. read more
Failure Modes in Wire bonded and Flip Chip Packages
The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly proce
.. read more
Choosing a Low-Cost Alternative to Sac Alloys for PCB Assembly
Developing low-cost alternatives to near-eutectic SAC alloys for Pb-free assembly is crucial to continue producing affordable electronics products. Metals prices,especially silver,have been on
.. read more
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC)
failures under excessive PCB bending. Pad cratering cracks are not d
.. read more
A Plasma Deposited Surface Finish for Printed Circuit Boards
This paper will discuss a new approach to the final finishing for the PCB industry which is based on the use of an ultra-thin
fluoropolymer film as a protective coating to preserve solderabilit
.. read more
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. read more
How to Manage Wave Solder Alloy Contaminations
European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig
.. read more
The Elimination of Whiskers from Electroplated Tin
After the implementation of RoHS and the discontinued use of lead bearing products and the introduction of lead free (LF)
solders,tin and its alloys have come to the forefront as the first choi
.. read more
Effect of Gold Content on the Reliability of SnAgCu Solder Joints
Electroplated Ni/Au over Cu is a popular metallization for PCB finish as well as for component leads,especially wire-bondable high frequency packages,where the gold thickness requirement for wi
.. read more
Solder Charge Grid Array: Advancements in the Technology of Surface Mount Area Array Solder Joint Attachment
Surface mount area arrays (SMAA) have been in existence for decades and are increasingly becoming more important as printed circuit board (PCB) assemblies become further complex with package mi
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more
Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. read more
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping
In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains
.. read more
A Study of Solder Optimization Development for Portable Electronic Device
With increasing use of portable appliances such as PDA and cellular phone,changing environment of application requires higher solder joint reliability. The Cu-OSP process has been widely used f
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more
Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. read more
A Study of Reliability between Solder Alloy and Pad Materials
The low Ag solder alloy shows higher drop performance than the high Ag solder alloy in the every kind of package and board combinations. This is related to the ductility of solder and the surfa
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. read more
A Compliant and Creep Resistant SAC-Al(Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. read more
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. read more