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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Study Of Performance of Liquid Metal Containing Different Contents of Ag Particular Additives for Thermal Interface Materials
In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5
.. read more
Risk Mitigation in Hand Soldering
Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery,flux chemistry,and solder chemistry creates the solder bond or
.. read more
Method to Measure Intermetallic Layer Thickness and Its Application to Develop a New Equation to Predict Its Growth
Lead Free Technology has brought new materials and different quality concerns to the Electronics Industry. For that,the creation of new methods to determine the quality of materials is needed a
.. read more
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish
In this paper,we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints
on the central pad of two different packages – QFN and an Agilent package
.. read more
Effect of Cooling Rate on the Intermetallic Layer in Solder Joints
While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two diff
.. read more
The Use of SAC Solder and Pb-Free Lead Materials in the Repair Scenario
Much work has been done involving the introduction of RoHS and WEEE Directives across the European Union and the
world. Although the use of Pb is limited in new products and equipment,older Pb-
.. read more
Reliability Testing and Failure Analysis of Lead-Free Solder Joints under Thermo-Mechanical Stress
The commercial use of lead-free solder has been making significant gains worldwide in recent years. To identify the effects
of thermo-mechanical stress on Sn-Ag-Cu and Sn-Zn-Bi solder with diff
.. read more
HDPUG's Failure Analysis of High-Density Packages’ Lead-Free Solder Joints
Failure analyses of the leadfree and SnPb solder joints of high-density packages such as the PBGA (plastic ball grid
array) and the CCGA (ceramic column grid array) soldered on SnCu HASL (hot-a
.. read more
Study Of Performance of Liquid Metal Containing Different Contents of Ag Particular Additives for Thermal Interface Materials
In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5
.. read more
Risk Mitigation in Hand Soldering
Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery,flux chemistry,and solder chemistry creates the solder bond or
.. read more
Method to Measure Intermetallic Layer Thickness and Its Application to Develop a New Equation to Predict Its Growth
Lead Free Technology has brought new materials and different quality concerns to the Electronics Industry. For that,the creation of new methods to determine the quality of materials is needed a
.. read more
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish
In this paper,we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints
on the central pad of two different packages – QFN and an Agilent package
.. read more
Effect of Cooling Rate on the Intermetallic Layer in Solder Joints
While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two diff
.. read more
The Use of SAC Solder and Pb-Free Lead Materials in the Repair Scenario
Much work has been done involving the introduction of RoHS and WEEE Directives across the European Union and the
world. Although the use of Pb is limited in new products and equipment,older Pb-
.. read more
Reliability Testing and Failure Analysis of Lead-Free Solder Joints under Thermo-Mechanical Stress
The commercial use of lead-free solder has been making significant gains worldwide in recent years. To identify the effects
of thermo-mechanical stress on Sn-Ag-Cu and Sn-Zn-Bi solder with diff
.. read more
HDPUG's Failure Analysis of High-Density Packages’ Lead-Free Solder Joints
Failure analyses of the leadfree and SnPb solder joints of high-density packages such as the PBGA (plastic ball grid
array) and the CCGA (ceramic column grid array) soldered on SnCu HASL (hot-a
.. read more