Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Management and Mitigation of Tin Whiskers for Lead-Free Electronics
The lead-free directive from the EU has created a number of challenges for high reliability electronic applications. Key among those challenges is the need to address the issue of tin whiskers.
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A Test Methodology for Copper Dissolution in Lead-Free Alloys
Lead-free selective soldering can result in extended times at high temperatures,which in turn can result in excessive dissolution of exposed copper,such as plated through holes. This phenomenon
.. read more
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. read more
Design for Manufacturability in the Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
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Performance of China Alloy SnAgCuCe in Reflow Soldering
Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w
.. read more
Management and Mitigation of Tin Whiskers for Lead-Free Electronics
The lead-free directive from the EU has created a number of challenges for high reliability electronic applications. Key among those challenges is the need to address the issue of tin whiskers.
.. read more
A Test Methodology for Copper Dissolution in Lead-Free Alloys
Lead-free selective soldering can result in extended times at high temperatures,which in turn can result in excessive dissolution of exposed copper,such as plated through holes. This phenomenon
.. read more
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. read more
Design for Manufacturability in the Lead Free Wave Solder Process
The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D
.. read more
Performance of China Alloy SnAgCuCe in Reflow Soldering
Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w
.. read more