Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

Filters
Filters
Reset Filters
Display

System in Package (SiP) and CSPs Underfilling on Reliability

This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)]in a fine pitch ball grid array (FPBGA). More importantly, it p .. read more

Rework and Reliability of High I/O Column Grid Array Assemblies

Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ .. read more

Cost effective 3D Glass Microfabrication for Advanced Electronic Packages

Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility need .. read more

System in Package (SiP) and CSPs Underfilling on Reliability

This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)]in a fine pitch ball grid array (FPBGA). More importantly, it p .. read more

Rework and Reliability of High I/O Column Grid Array Assemblies

Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ .. read more

Cost effective 3D Glass Microfabrication for Advanced Electronic Packages

Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility need .. read more