Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effect of Aging on BGA Solder Strengths & Thermal Cycles for Low Temperature Hybrid Assembly
This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability and the other for commercial applications. For high reliability, it
.. read more
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free
.. read more
High Temperature Reliability of Components for Power Computing with SAC305 and Alternative High Reliability Solders with Isothermal Aging at 25...
This experiment considers the reliability of a variety of different electronic components under isothermal aging and subsequent thermal cycling (TC) testing. The components are evaluated on 0.2
.. read more
Rework and Reliability of High I/O Column Grid Array Assemblies
Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ
.. read more
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish
In this paper,we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints
on the central pad of two different packages – QFN and an Agilent package
.. read more
Effect of Cooling Rate on the Intermetallic Layer in Solder Joints
While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two diff
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more
Lead Free 0201 Assembly and Thermal Cycle/Aging Reliability
The many challenges with 0201 passive component assembly can be attributed to the solder paste volume,pad design,
aperture design,board finish,type of solder paste,pick-and-place,and reflow pro
.. read more
Effect of Aging on BGA Solder Strengths & Thermal Cycles for Low Temperature Hybrid Assembly
This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability and the other for commercial applications. For high reliability, it
.. read more
Reliability of ENEPIG by Sequential Thermal Cycling and Aging
Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free
.. read more
High Temperature Reliability of Components for Power Computing with SAC305 and Alternative High Reliability Solders with Isothermal Aging at 25...
This experiment considers the reliability of a variety of different electronic components under isothermal aging and subsequent thermal cycling (TC) testing. The components are evaluated on 0.2
.. read more
Rework and Reliability of High I/O Column Grid Array Assemblies
Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ
.. read more
The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish
In this paper,we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints
on the central pad of two different packages – QFN and an Agilent package
.. read more
Effect of Cooling Rate on the Intermetallic Layer in Solder Joints
While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two diff
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more
Lead Free 0201 Assembly and Thermal Cycle/Aging Reliability
The many challenges with 0201 passive component assembly can be attributed to the solder paste volume,pad design,
aperture design,board finish,type of solder paste,pick-and-place,and reflow pro
.. read more