Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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An Investigation of Whisker Growth on Tin Coated Wire and Braid
Pure tin is a common finish for copper hook up wire,coaxial cable,ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports of whisker growth
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Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components
This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin
.. read more
An Investigation of Whisker Growth on Tin Coated Wire and Braid
Pure tin is a common finish for copper hook up wire,coaxial cable,ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports of whisker growth
.. read more
Effects of Tin Mitigation Processes on Whisker Growth and Solder Joint Reliability for Chip and Small-Outline Package Components
This paper reports the results of an evaluation of tin mitigation processes for components,i.e. converting parts with pure tin (Sn) and other lead-free (Pb-free) finishes to tin-lead (SnPb) fin
.. read more