Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop Shock Resistance
DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock pe
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Third Report: Comparison of Four Low-Silver Sphere Alloys and...
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Initial Report
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more
A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop Shock Resistance
DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock pe
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Third Report: Comparison of Four Low-Silver Sphere Alloys and...
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Initial Report
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more