Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle
As the demand for higher routing density and transfer speed increases,Via-In-Pad Plated Over (VIPPO)has become more common on high-end telecommunications products. The interactions of VIPPO wit
.. read more
Transient Solder Separation of BGA Solder Joint During Second Reflow Cycle
As the demand for higher routing density and transfer speed increases,Via-In-Pad Plated Over (VIPPO)has become more common on high-end telecommunications products. The interactions of VIPPO wit
.. read more