Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. read more
Image Rotation to Mitigate the Fiberweave Effect its Impact on PCB Manufacturing
Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean
.. read more
A Comparison Study on Sn3.5Ag and Sn3.8Ag0.7Cu C5 Lead Free Solder System
A comparison study was carried out with Sn3.5Ag and Sn3.8Ag0.7Cu solder balls on Ball Grid Array (BGA) components
with Cu/Ni/Au pad finishing. This study shows that Sn3.5Ag C5 solder system per
.. read more
Investigating Mass Imaging Lead Free Materials Using Enclosed Print Head Technology
Within the Surface Mount Assembly (S.M.A.) process,solder paste is primarily used as a mechanical and electrical
connection. Solder paste is generally deposited using a mass imaging process,suc
.. read more
Testing the Long Term Reliability of an Environmentally Friendly PCB Final Finish
The new plasma polymer PCB final finish that eliminates harsh chemicals and waste streams also promises to eliminate creep corrosion,but will it stand the test of time? Before any new produc
.. read more
Image Rotation to Mitigate the Fiberweave Effect its Impact on PCB Manufacturing
Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean
.. read more
A Comparison Study on Sn3.5Ag and Sn3.8Ag0.7Cu C5 Lead Free Solder System
A comparison study was carried out with Sn3.5Ag and Sn3.8Ag0.7Cu solder balls on Ball Grid Array (BGA) components
with Cu/Ni/Au pad finishing. This study shows that Sn3.5Ag C5 solder system per
.. read more
Investigating Mass Imaging Lead Free Materials Using Enclosed Print Head Technology
Within the Surface Mount Assembly (S.M.A.) process,solder paste is primarily used as a mechanical and electrical
connection. Solder paste is generally deposited using a mass imaging process,suc
.. read more