Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. read more
Dielectric Constant and Dissapation Factor of Fr4 Laminates Produced Using Specific Vendors of Fiberglass Yarn
Currently there is not a specification within the IPC for the DK and DF of E-Glass reinforcements and there is no
requirement to report the DK and DF of the glass formulation used to produce E-
.. read more
Reliability of High Density,High Layer Count,Multilayer Backplanes
This paper discusses the work and testing performed to obtain extreme high reliability performance from high layer count,
large panel format multilayer printed wiring boards that are used for b
.. read more
Printed Circuit Board Reliability in High Temperature
This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed
circuit boards from a broad range of laminate materials for both t
.. read more
A Comparative Study of PWB’s Containing Halogenated and Halogen Free Flame-Retardants
In order to evaluate the relative merits of halogenated and alternative flame-retardants used in PWB’s,a comparison
between several different PWB’s each having different flame-retardant package
.. read more
A Second Look At Injection Via Fill Process Capability,And Material Property Issues
In the United States,focus turns toward enabling technology for quick-turn printed circuit board and laminate package
manufacturing. The current corporate mandate is to develop advanced,enablin
.. read more
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. read more
Dielectric Constant and Dissapation Factor of Fr4 Laminates Produced Using Specific Vendors of Fiberglass Yarn
Currently there is not a specification within the IPC for the DK and DF of E-Glass reinforcements and there is no
requirement to report the DK and DF of the glass formulation used to produce E-
.. read more
Reliability of High Density,High Layer Count,Multilayer Backplanes
This paper discusses the work and testing performed to obtain extreme high reliability performance from high layer count,
large panel format multilayer printed wiring boards that are used for b
.. read more
Printed Circuit Board Reliability in High Temperature
This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed
circuit boards from a broad range of laminate materials for both t
.. read more
A Comparative Study of PWB’s Containing Halogenated and Halogen Free Flame-Retardants
In order to evaluate the relative merits of halogenated and alternative flame-retardants used in PWB’s,a comparison
between several different PWB’s each having different flame-retardant package
.. read more
A Second Look At Injection Via Fill Process Capability,And Material Property Issues
In the United States,focus turns toward enabling technology for quick-turn printed circuit board and laminate package
manufacturing. The current corporate mandate is to develop advanced,enablin
.. read more