Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Verification of a Finite Element Analysis Model Predicting Laminate Cracks in a Printed Circuit Card
A supplier was experiencing laminate cracks in an FR4 dielectric constructed material product after successfully producing this Printed Circuit Board (PCB) for a number of years. The issue w
.. read more
Printed Circuit Board Edge Burn Outs – Failure Mechanism
This paper documents an investigation of printed circuit board (PCB) failures due to edge burn outs. Electrical shorts were observed at late-stage environmental stress screening and electric
.. read more
A New Approach for Early Detection of PCB Pad Cratering Failures
Pad cratering refers to the initiation and propagation of fine cracks beneath BGA pads in organic substrates or printed circuit boards. These cracks,which usually initiate under the application
.. read more
Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. read more
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. read more
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. read more
Verification of a Finite Element Analysis Model Predicting Laminate Cracks in a Printed Circuit Card
A supplier was experiencing laminate cracks in an FR4 dielectric constructed material product after successfully producing this Printed Circuit Board (PCB) for a number of years. The issue w
.. read more
Printed Circuit Board Edge Burn Outs – Failure Mechanism
This paper documents an investigation of printed circuit board (PCB) failures due to edge burn outs. Electrical shorts were observed at late-stage environmental stress screening and electric
.. read more
A New Approach for Early Detection of PCB Pad Cratering Failures
Pad cratering refers to the initiation and propagation of fine cracks beneath BGA pads in organic substrates or printed circuit boards. These cracks,which usually initiate under the application
.. read more
Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. read more
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. read more
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. read more