Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Solve BGA VIPPO Failures with Advanced Materials
Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicke
.. read more
Using Embedded Capacitance to Improve Electrical Performance,Eliminate Capacitors and Reduce Board Size In High Speed Digital and RF Applications
The global electronics industry is exhibiting a widespread and growing interest in the technology of embedded passives. This interest can be attributed to three primary benefits. First,embedded
.. read more
Lead Free Assembly: Identifying Compatible Base Materials for Your Application
Whether based on good science or not,the elimination of lead from electronic equipment as a result of the European RoHS
legislation is a reality. Even those market segments with exemptions mean
.. read more
Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection
Electronic products are being stressed by increasing operating temperatures and higher assembly temperatures. Silicon and
product power consumption are increasing as the silicon densities and s
.. read more
Solve BGA VIPPO Failures with Advanced Materials
Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicke
.. read more
Using Embedded Capacitance to Improve Electrical Performance,Eliminate Capacitors and Reduce Board Size In High Speed Digital and RF Applications
The global electronics industry is exhibiting a widespread and growing interest in the technology of embedded passives. This interest can be attributed to three primary benefits. First,embedded
.. read more
Lead Free Assembly: Identifying Compatible Base Materials for Your Application
Whether based on good science or not,the elimination of lead from electronic equipment as a result of the European RoHS
legislation is a reality. Even those market segments with exemptions mean
.. read more
Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection
Electronic products are being stressed by increasing operating temperatures and higher assembly temperatures. Silicon and
product power consumption are increasing as the silicon densities and s
.. read more