Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Chemical and Microscopic Analyses of Laser Microvia Samples
Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in
.. read more
Temperature Behavior of FR4 Substrates when Processing During Laser Depaneling
The use of modern laser systems for depaneling printed circuit boards can present many advantages as well as some challenges for the production engineer compared to conventional mechanical s
.. read more
Copper Filled Microvias - The New Hidden Threat Links of Faith Are Not Created Equally
Microvias connect adjacent copper layers to complete electrical paths. Copper-filled microvias can be stacked to form connections beyond adjacent copper layers. Staggered microvias stitch ad
.. read more
Automating the Rework Process: Technology Advancement Replaces Manual Method
Automated Optical Rework (AOR) is a new method of reworking shorts by using a fully automated fine laser beam to ablate
any excess copper in fine-line PCB patterns. This includes shorts,protrus
.. read more
Enabling Ultra-Fine Pitch Packages: Soldermask Patterning using Laser Ablation
The trend towards tighter pitch,smaller features,and shrinking pad sizes have put a strain on the standard photolithographic
processes for soldermask patterning on substrate packaging and rigid
.. read more
Laser Ablation in the Interconnect Industry
The last 10 years have seen the rise of lasers used in the interconnect industry to a point where their use is almost becoming ‘main stream’. As line width and spacing requirements become small
.. read more
Chemical and Microscopic Analyses of Laser Microvia Samples
Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in
.. read more
Temperature Behavior of FR4 Substrates when Processing During Laser Depaneling
The use of modern laser systems for depaneling printed circuit boards can present many advantages as well as some challenges for the production engineer compared to conventional mechanical s
.. read more
Copper Filled Microvias - The New Hidden Threat Links of Faith Are Not Created Equally
Microvias connect adjacent copper layers to complete electrical paths. Copper-filled microvias can be stacked to form connections beyond adjacent copper layers. Staggered microvias stitch ad
.. read more
Automating the Rework Process: Technology Advancement Replaces Manual Method
Automated Optical Rework (AOR) is a new method of reworking shorts by using a fully automated fine laser beam to ablate
any excess copper in fine-line PCB patterns. This includes shorts,protrus
.. read more
Enabling Ultra-Fine Pitch Packages: Soldermask Patterning using Laser Ablation
The trend towards tighter pitch,smaller features,and shrinking pad sizes have put a strain on the standard photolithographic
processes for soldermask patterning on substrate packaging and rigid
.. read more
Laser Ablation in the Interconnect Industry
The last 10 years have seen the rise of lasers used in the interconnect industry to a point where their use is almost becoming ‘main stream’. As line width and spacing requirements become small
.. read more