Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Microvia Process Guidelines
High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circ
.. read more
Process Improvement Strategies for Weak Microvia Interfaces
The industry has been openly discussing the concern about weak microvia interfaces after IR reflow and the potential for an undetected open or latent defect that can escape after expensive c
.. read more
The Complete Path to Least Resistance
The electroless copper deposit must form a metallurgical bond between the target pad and electrolytic copper deposit to survive reflow assembly. 4-wire resistance measurements conducted on P
.. read more
Microvia PWB's Qualified for Avionics,Microvias Can Enhance PWB Reliability
Laser-drilled microvias are being added to the list of approved technologies for printed wiring boards destined for use in a rapidly increasing number of application types and environments. Mic
.. read more
Three Reasons Why You Should Design Your Next Product With Laser Drilled Micro-Vias
If in designing your next product you are interested in cost reduction,reliability improvement,and increased electrical performance,then you should be considering using laser-drilled vias. Not
.. read more
Microvia Process Guidelines
High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circ
.. read more
Process Improvement Strategies for Weak Microvia Interfaces
The industry has been openly discussing the concern about weak microvia interfaces after IR reflow and the potential for an undetected open or latent defect that can escape after expensive c
.. read more
The Complete Path to Least Resistance
The electroless copper deposit must form a metallurgical bond between the target pad and electrolytic copper deposit to survive reflow assembly. 4-wire resistance measurements conducted on P
.. read more
Microvia PWB's Qualified for Avionics,Microvias Can Enhance PWB Reliability
Laser-drilled microvias are being added to the list of approved technologies for printed wiring boards destined for use in a rapidly increasing number of application types and environments. Mic
.. read more
Three Reasons Why You Should Design Your Next Product With Laser Drilled Micro-Vias
If in designing your next product you are interested in cost reduction,reliability improvement,and increased electrical performance,then you should be considering using laser-drilled vias. Not
.. read more