Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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SLP+
As the IoT market demands higher data rates and processing,the PCB technology is driving for smaller form factors,higher signal densities,and advanced material solutions. Miniaturization has be
.. read more
Mechanically Drilled Controlled Depth Micro Vias an Alternative to Laser Drilling
As the requirements for controlled depth micro-vias become ever increasing in today’s market place the best feasible solution
appears to be laser drilling. However laser drilling can be problem
.. read more
Micro Via Drilling Technology
Currently,PWB industry is striving for the cost down at the daily PWB manufacturing,and at the same time,they are
developing the higher density PWB for the future application.
The emerging 300
.. read more
Advanced Packaging Using Liquid Crystalline Polymer (LCP) Substrates
Liquid crystalline polymer (LCP) substrates offer a number of advantages for high-density packaging. These properties include high temperature capability (>250oC),low coefficient of thermal exp
.. read more
Improving Yield and Profitability with Laser Drilled Blind Microvias
Laser drilling has clearly captured the technology lead in the formation of HDI microvias with a 78% ownership,1
currently dominating over photo defined,plasma etched and mechanically drilled m
.. read more
Laser Drillable Prepreg Alternative to Coated Copper for HDI Applications
There is a contingent in the industry that feels reinforced substrates are needed to meet the performance
requirements of HDI microvia technology. Concerns that non-reinforced resin coated foil
.. read more
Laser Drilling MicroVias
There is a growing need in today’s electronic market for high performance Printed Circuit Boards (PCBs) with highspeed signals and enhanced performance. However,they must maintain signal integr
.. read more
PCB Laser Technology for Rigid and Flex HDI - Via Formation,Structuring,Routing
A new versatile laser technology is available that is capable of working with both rigid and flexible boards using only one laser source. This system is based on a THG-UV laser (355 nm) and vec
.. read more
Three Reasons Why You Should Design Your Next Product With Laser Drilled Micro-Vias
If in designing your next product you are interested in cost reduction,reliability improvement,and increased electrical performance,then you should be considering using laser-drilled vias. Not
.. read more
SLP+
As the IoT market demands higher data rates and processing,the PCB technology is driving for smaller form factors,higher signal densities,and advanced material solutions. Miniaturization has be
.. read more
Mechanically Drilled Controlled Depth Micro Vias an Alternative to Laser Drilling
As the requirements for controlled depth micro-vias become ever increasing in today’s market place the best feasible solution
appears to be laser drilling. However laser drilling can be problem
.. read more
Micro Via Drilling Technology
Currently,PWB industry is striving for the cost down at the daily PWB manufacturing,and at the same time,they are
developing the higher density PWB for the future application.
The emerging 300
.. read more
Advanced Packaging Using Liquid Crystalline Polymer (LCP) Substrates
Liquid crystalline polymer (LCP) substrates offer a number of advantages for high-density packaging. These properties include high temperature capability (>250oC),low coefficient of thermal exp
.. read more
Improving Yield and Profitability with Laser Drilled Blind Microvias
Laser drilling has clearly captured the technology lead in the formation of HDI microvias with a 78% ownership,1
currently dominating over photo defined,plasma etched and mechanically drilled m
.. read more
Laser Drillable Prepreg Alternative to Coated Copper for HDI Applications
There is a contingent in the industry that feels reinforced substrates are needed to meet the performance
requirements of HDI microvia technology. Concerns that non-reinforced resin coated foil
.. read more
Laser Drilling MicroVias
There is a growing need in today’s electronic market for high performance Printed Circuit Boards (PCBs) with highspeed signals and enhanced performance. However,they must maintain signal integr
.. read more
PCB Laser Technology for Rigid and Flex HDI - Via Formation,Structuring,Routing
A new versatile laser technology is available that is capable of working with both rigid and flexible boards using only one laser source. This system is based on a THG-UV laser (355 nm) and vec
.. read more
Three Reasons Why You Should Design Your Next Product With Laser Drilled Micro-Vias
If in designing your next product you are interested in cost reduction,reliability improvement,and increased electrical performance,then you should be considering using laser-drilled vias. Not
.. read more