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A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications
The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield,eliminate the head-in-pillow effect,and enhance re
.. read more
A Study on Copper Dissolution in Liquid Lead Free Solders under Static and Dynamic Conditions
During lead-free wave soldering or rework operation for through hole components,high rate copper dissolution may occur to printed wiring boards. It is widely believed that Sn-Ag-Cu (SAC) lead-f
.. read more
A Test Methodology for Copper Dissolution in Lead-Free Alloys
Lead-free selective soldering can result in extended times at high temperatures,which in turn can result in excessive dissolution of exposed copper,such as plated through holes. This phenomenon
.. read more
Impact of Lead Contamination on Reliability of Lead Free Alloys
Meeting the RoHS directive will require the transition from the historical tin-lead based system of materials to one that
does not contain lead. This is of course is not straight forward as it
.. read more
A Lower Temperature Solder Joint Encapsulant for Sn/Bi Applications
The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield,eliminate the head-in-pillow effect,and enhance re
.. read more
A Study on Copper Dissolution in Liquid Lead Free Solders under Static and Dynamic Conditions
During lead-free wave soldering or rework operation for through hole components,high rate copper dissolution may occur to printed wiring boards. It is widely believed that Sn-Ag-Cu (SAC) lead-f
.. read more
A Test Methodology for Copper Dissolution in Lead-Free Alloys
Lead-free selective soldering can result in extended times at high temperatures,which in turn can result in excessive dissolution of exposed copper,such as plated through holes. This phenomenon
.. read more
Impact of Lead Contamination on Reliability of Lead Free Alloys
Meeting the RoHS directive will require the transition from the historical tin-lead based system of materials to one that
does not contain lead. This is of course is not straight forward as it
.. read more