Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effect of Lead Free Assembly Reflow Cycles on Base Material Substrate Properties
Regulatory restrictions and environmental needs are moving the electronics industry towards lead-free solders and other
environmentally friendly materials. This massive effort has resulted in n
.. read more
Lead Free Assembly: Identifying Compatible Base Materials for Your Application
Whether based on good science or not,the elimination of lead from electronic equipment as a result of the European RoHS
legislation is a reality. Even those market segments with exemptions mean
.. read more
Microvia Reliability Concerns in the Lead Free Assembly Environment
Traditionally microvias have been considered to be the most reliable interconnect structure within a printed wiring board (PWB). With the advent of lead free assembly the vulnerability of high
.. read more
Maximizing Lead Free Wetting
As lead free assembly is ramping up,wetting of lead free solder pastes is surfacing as the major paste performance tradeoff.
Global efforts to significantly increase lead free wetting chemicall
.. read more
Effects of Cooling Slopes in Lead Free Reflow
As more electronic assemblers move to lead free SMT production,concerns are raised over reflow cooling slopes and effects
on solder joints. Due to the higher peak temperatures,cooling slopes ar
.. read more
Effect of Lead Free Assembly Reflow Cycles on Base Material Substrate Properties
Regulatory restrictions and environmental needs are moving the electronics industry towards lead-free solders and other
environmentally friendly materials. This massive effort has resulted in n
.. read more
Lead Free Assembly: Identifying Compatible Base Materials for Your Application
Whether based on good science or not,the elimination of lead from electronic equipment as a result of the European RoHS
legislation is a reality. Even those market segments with exemptions mean
.. read more
Microvia Reliability Concerns in the Lead Free Assembly Environment
Traditionally microvias have been considered to be the most reliable interconnect structure within a printed wiring board (PWB). With the advent of lead free assembly the vulnerability of high
.. read more
Maximizing Lead Free Wetting
As lead free assembly is ramping up,wetting of lead free solder pastes is surfacing as the major paste performance tradeoff.
Global efforts to significantly increase lead free wetting chemicall
.. read more
Effects of Cooling Slopes in Lead Free Reflow
As more electronic assemblers move to lead free SMT production,concerns are raised over reflow cooling slopes and effects
on solder joints. Due to the higher peak temperatures,cooling slopes ar
.. read more