Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Filling in the Gaps in Lead-Free Reliability Modeling and Testing
This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the
.. read more
Design Considerations for High Reliability PCB
- History & Importance of PCB - Environmental Initiatives - Reliability Consideration With High Temp Processing - Reliability Considerations for Materials to withstand Lead-Free Assembly
.. read more
The Landscape of PCB Technology is changing rapidly. How Will AOI Testing Keep Up?
Ideas,manufacturing processes,materials and components that were in the realm of science fiction a few years ago are now being adopted into mainstream PCB products. Devices are getting smaller,
.. read more
Reliability of Partially Filled SAC305 Through-Hole Joints
Consistently achieving acceptable wave solder through-hole fill on thick boards is a well-known process challenge,but the
introduction of lead free solders has created additional difficulties.
.. read more
Filling in the Gaps in Lead-Free Reliability Modeling and Testing
This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the
.. read more
Design Considerations for High Reliability PCB
- History & Importance of PCB - Environmental Initiatives - Reliability Consideration With High Temp Processing - Reliability Considerations for Materials to withstand Lead-Free Assembly
.. read more
The Landscape of PCB Technology is changing rapidly. How Will AOI Testing Keep Up?
Ideas,manufacturing processes,materials and components that were in the realm of science fiction a few years ago are now being adopted into mainstream PCB products. Devices are getting smaller,
.. read more
Reliability of Partially Filled SAC305 Through-Hole Joints
Consistently achieving acceptable wave solder through-hole fill on thick boards is a well-known process challenge,but the
introduction of lead free solders has created additional difficulties.
.. read more