Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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The Role of Organic Amines in Soldering Materials
The transition from eutectic tin-lead to lead-free soldering in electronic assembly,mandatedby the RoHS legislation, has brought great pressure and challenge to solder mater
.. read more
Method for the Manufacture of an Aluminum Substrate PCB and its Advantages
RoHS legislated restrictions on the materials used in electronics manufacture have imparted significant challenges on the electronics industry since their introduction in 2006. The greatest imp
.. read more
Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the second of two papers discussing the companies Lower Melt Alloy program. The first paper was presented at IPC APEX2013. The program explores the manufacturability and reliabili
.. read more
A Review of Issues and Next Steps in Moving From Sn3Ag0.5Cu to Low Silver Solder Alloys
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. read more
Evaluation of Lead Free Solder Paste Materials for PCBA
Most of electronic components on a printed circuit board assembly (PCBA) are surface mount components assembled using solder paste material. Having a good solder paste material is very critical
.. read more
Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points
Hot gas rework of BGAs with a mirrored BGA design configuration using SnAgCu based lead-free alloys is more challenging as compared to conventional SnPb techniques. Rework of BGAs using a conve
.. read more
Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. read more
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. read more
Resin Options for Lead-Free Printed Circuit Boards
The regulation requiring lead-free solders for printed circuit boards (PCBs) has presented a number of challenges to our industry at virtually every stage of the process. For the brominated epo
.. read more
Measuring the True Wetting Time of Solders
As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl
.. read more
Optimizing Pallet Materials for Long Life and Ease of Machining
This paper will present seven different materials used for the production of both wave solder and reflow solder pallets. The goal of this study will be for the purpose of depicting machining ca
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
Novel High Temperature Resistant OSP Coatings for Lead-free Processing
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. read more
Understanding Stencil Requirements for a Lead Free Mass Imaging Process
Many words have been written about the impending lead free transition,during this period of frantic discovery lots has
been communicated about the reflow and alloy concerns; But the print proce
.. read more
Assembly Verification of an Immersion Silver Finish with Enhanced Tarnish Inhibition
New ROHS standards are forcing the electronics industry to find a replacement for leaded surface finishes. Even more
rapidly than the legislative decision to move away from lead,electronics wer
.. read more
Backward Compatibility Study of Lead Free Area Array Packages with Tin-Lead Soldering Process
In response to RoHS and other international environmental legislation,the semiconductor industry is moving toward the
elimination of lead (Pb) from packages. During the transitional period,both
.. read more
C4NP Lead Free vs. Electroplated High Lead Solder Bumps
There are various C4 (Controlled Collapse Chip Connection) solder bumping technologies used in volume production. These
include electroplating,solder paste printing,evaporation and the direct a
.. read more
Thermal Stress Testing & Impact of High Thermal Excursion Pre-Conditioning on Cycles to Fail
Today both Interconnect Stress Test (IST) and Highly Accelerated Thermal Shock (HATS) test methods are used to measure
plated through hole via reliability. Both of these test methods have prove
.. read more
“Lessons Learned from Seven Years Experience of Lead Free Wave Soldering”
Although in Europe and North America wave soldering is widely regarded as a process that is being rendered obsolete by reflow processes the proliferation of electronic circuitry has more than c
.. read more
The Effect of Filling VIA-In-Pad-On Voiding Rates in PWB Assembly for BGA Components
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize
voiding,particularly with the advent of lead-free processing and in fine f
.. read more
The Role of Organic Amines in Soldering Materials
The transition from eutectic tin-lead to lead-free soldering in electronic assembly,mandatedby the RoHS legislation, has brought great pressure and challenge to solder mater
.. read more
Method for the Manufacture of an Aluminum Substrate PCB and its Advantages
RoHS legislated restrictions on the materials used in electronics manufacture have imparted significant challenges on the electronics industry since their introduction in 2006. The greatest imp
.. read more
Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the second of two papers discussing the companies Lower Melt Alloy program. The first paper was presented at IPC APEX2013. The program explores the manufacturability and reliabili
.. read more
A Review of Issues and Next Steps in Moving From Sn3Ag0.5Cu to Low Silver Solder Alloys
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. read more
Evaluation of Lead Free Solder Paste Materials for PCBA
Most of electronic components on a printed circuit board assembly (PCBA) are surface mount components assembled using solder paste material. Having a good solder paste material is very critical
.. read more
Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points
Hot gas rework of BGAs with a mirrored BGA design configuration using SnAgCu based lead-free alloys is more challenging as compared to conventional SnPb techniques. Rework of BGAs using a conve
.. read more
Hot Air Solder Leveling in the Lead-free Era
Although the advantages of Hot Air Solder Leveling (HASL) in providing the most robust solderable finish for printed circuit boards are well recognized,in the years leading up to the implementa
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. read more
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. read more
Resin Options for Lead-Free Printed Circuit Boards
The regulation requiring lead-free solders for printed circuit boards (PCBs) has presented a number of challenges to our industry at virtually every stage of the process. For the brominated epo
.. read more
Measuring the True Wetting Time of Solders
As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl
.. read more
Optimizing Pallet Materials for Long Life and Ease of Machining
This paper will present seven different materials used for the production of both wave solder and reflow solder pallets. The goal of this study will be for the purpose of depicting machining ca
.. read more
Lead Free Solder Paste Printing: Stencil and Squeegee Blade Impact
Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global
electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi
.. read more
Novel High Temperature Resistant OSP Coatings for Lead-free Processing
In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al
.. read more
Understanding Stencil Requirements for a Lead Free Mass Imaging Process
Many words have been written about the impending lead free transition,during this period of frantic discovery lots has
been communicated about the reflow and alloy concerns; But the print proce
.. read more
Assembly Verification of an Immersion Silver Finish with Enhanced Tarnish Inhibition
New ROHS standards are forcing the electronics industry to find a replacement for leaded surface finishes. Even more
rapidly than the legislative decision to move away from lead,electronics wer
.. read more
Backward Compatibility Study of Lead Free Area Array Packages with Tin-Lead Soldering Process
In response to RoHS and other international environmental legislation,the semiconductor industry is moving toward the
elimination of lead (Pb) from packages. During the transitional period,both
.. read more
C4NP Lead Free vs. Electroplated High Lead Solder Bumps
There are various C4 (Controlled Collapse Chip Connection) solder bumping technologies used in volume production. These
include electroplating,solder paste printing,evaporation and the direct a
.. read more
Thermal Stress Testing & Impact of High Thermal Excursion Pre-Conditioning on Cycles to Fail
Today both Interconnect Stress Test (IST) and Highly Accelerated Thermal Shock (HATS) test methods are used to measure
plated through hole via reliability. Both of these test methods have prove
.. read more
“Lessons Learned from Seven Years Experience of Lead Free Wave Soldering”
Although in Europe and North America wave soldering is widely regarded as a process that is being rendered obsolete by reflow processes the proliferation of electronic circuitry has more than c
.. read more
The Effect of Filling VIA-In-Pad-On Voiding Rates in PWB Assembly for BGA Components
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize
voiding,particularly with the advent of lead-free processing and in fine f
.. read more