Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Lead-free Feasibility Program: Assembly and Testing of a Functional Military Avionics Unit

Although the official implementation of the EU Restriction of Hazardous Substances (RoHS) directive officially started on July 1,2006,a significant portion of the avionics electronics supply ch .. read more

Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection

Electronic products are being stressed by increasing operating temperatures and higher assembly temperatures. Silicon and product power consumption are increasing as the silicon densities and s .. read more

An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability

Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. Solders containing lead have been the standard in printed circuit assembly processes. Lead-free sol .. read more

Assembly,Rework and Reliability of Lead-free FCBGA Soldered Component

Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has passed legislation requiring the removal of lead from electronics assembly b .. read more

Lead-free Feasibility Program: Assembly and Testing of a Functional Military Avionics Unit

Although the official implementation of the EU Restriction of Hazardous Substances (RoHS) directive officially started on July 1,2006,a significant portion of the avionics electronics supply ch .. read more

Lead-Free Product Transition: Impact on Printed Circuit Board Design and Material Selection

Electronic products are being stressed by increasing operating temperatures and higher assembly temperatures. Silicon and product power consumption are increasing as the silicon densities and s .. read more

An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability

Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. Solders containing lead have been the standard in printed circuit assembly processes. Lead-free sol .. read more

Assembly,Rework and Reliability of Lead-free FCBGA Soldered Component

Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has passed legislation requiring the removal of lead from electronics assembly b .. read more