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Effect of Aging on BGA Solder Strengths & Thermal Cycles for Low Temperature Hybrid Assembly

This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability and the other for commercial applications. For high reliability, it .. read more

Productivity and Cost Efficiency of Lead-Free Selective Soldering

With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when soldering RoHS compliant through-hole devices. Many contract electroni .. read more

Creep of Sn-(3.5-3.9)wt%Ag-(0.5-0.8)wt%Cu Lead-Free Solder Alloys and Their Solder Joint Reliability

A new set of constitutive equations for a class of lead-free solder alloys,Sn(3.5-3.9)wt%Ag(0.5-0.8)wt%Cu is proposed in this investigation. These equations are applied to a 256PBGA (plastic ba .. read more

Effect of Aging on BGA Solder Strengths & Thermal Cycles for Low Temperature Hybrid Assembly

This paper presents two key aspects of reliability of ball grid array (BGA) technologies: one aspect for high-reliability and the other for commercial applications. For high reliability, it .. read more

Productivity and Cost Efficiency of Lead-Free Selective Soldering

With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when soldering RoHS compliant through-hole devices. Many contract electroni .. read more

Creep of Sn-(3.5-3.9)wt%Ag-(0.5-0.8)wt%Cu Lead-Free Solder Alloys and Their Solder Joint Reliability

A new set of constitutive equations for a class of lead-free solder alloys,Sn(3.5-3.9)wt%Ag(0.5-0.8)wt%Cu is proposed in this investigation. These equations are applied to a 256PBGA (plastic ba .. read more