Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Lead Free Soldering: Impact on Laminates Requirements
Different legislations or draft directives target the restriction or the ban of the use of lead in the world. The law banning
lead-bearing electronic products (with a few exemptions) in the Eur
.. read more
Understanding the Impact of Accelerated Temperature Profiles on Lead-Free Soldering
Traditional reflow profiles for lead-free soldering typically require longer processing times due to elevated peak temperatures
and flux activation times defined by solder paste suppliers. Thes
.. read more
Next Generation Organic Solderability Preservatives (OSP) for Lead-free soldering and Mixed Metal Finish PWB’s and BGA Substrates
With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly
becoming more critical,fabricators and OEM’s must determine the mo
.. read more
Development of Assembly and Rework Processes for Large and Complex PCBs Using Lead-Free Solder
The continued functional densification and integration in networking products is driving the need to study large form factor
printed circuit boards that use high I/O packages (either ceramics c
.. read more
Lead Free Soldering: Impact on Laminates Requirements
Different legislations or draft directives target the restriction or the ban of the use of lead in the world. The law banning
lead-bearing electronic products (with a few exemptions) in the Eur
.. read more
Understanding the Impact of Accelerated Temperature Profiles on Lead-Free Soldering
Traditional reflow profiles for lead-free soldering typically require longer processing times due to elevated peak temperatures
and flux activation times defined by solder paste suppliers. Thes
.. read more
Next Generation Organic Solderability Preservatives (OSP) for Lead-free soldering and Mixed Metal Finish PWB’s and BGA Substrates
With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly
becoming more critical,fabricators and OEM’s must determine the mo
.. read more
Development of Assembly and Rework Processes for Large and Complex PCBs Using Lead-Free Solder
The continued functional densification and integration in networking products is driving the need to study large form factor
printed circuit boards that use high I/O packages (either ceramics c
.. read more