Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Achieving Solder Reliability for LGA Ceramic Image Sensors Through Refinement of SMT Soldering Processes
New product introduction at an Original Equipment Manufacturer (OEM) typically includes reliability testing in the form of thermal cycling. Samplings from the engineering models of a new pro
.. read more
Unique Implementation of a 15 Layer,Unboned/Looseleaf,Bookbinder Rigid Flex with Backdrill and LGA Interconnect
While flex and rigid flex (IPC-6013 Types 1 through 4i[1]) have always been important in 3D packaging to help resolve space constraints and meet other design requirements,the continued push for
.. read more
Achieving Solder Reliability for LGA Ceramic Image Sensors Through Refinement of SMT Soldering Processes
New product introduction at an Original Equipment Manufacturer (OEM) typically includes reliability testing in the form of thermal cycling. Samplings from the engineering models of a new pro
.. read more
Unique Implementation of a 15 Layer,Unboned/Looseleaf,Bookbinder Rigid Flex with Backdrill and LGA Interconnect
While flex and rigid flex (IPC-6013 Types 1 through 4i[1]) have always been important in 3D packaging to help resolve space constraints and meet other design requirements,the continued push for
.. read more