Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Applications of Semi-Additive Process Technology to PCB Design and Production
Traditional Subtractive Etch (SE) processes used to manufacture Printed Circuit Boards (PCBs) are adequate for many of today’s circuit designs. However, certain parts of PCBs, and more gener
.. read more
ULTRA HDI Printed Boards
This paper will discuss the evolution of the printed board design to date, how process improvements and new manufacturing technologies and chemistry have enabled the new step down in miniatu
.. read more
ULTRA HDI/SLP Production
This paper will discuss the difference between traditional advanced any layer HDI PCB with subtractive process and Ultra High-Density Interconnect (Ultra HDI) or substrate-like-PCB (SLP) wit
.. read more
Process Optimization for Fine Feature Solder Paste Dispensing
With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology,it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such
.. read more
Detailed Analysis of Impedance and Loss versus Frequency for Transmission Lines Made From Flexible Circuit Materials
With the emergence of high speed,controlled impedance circuits requiring increasingly tight tolerances,there is a realization among designers and fabricators that more precise data is needed th
.. read more
A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. read more
Electronics Manufacturing by Inkjet Printing
Inkjet printing is of great interest in the field of electronics manufacture because its digital nature negates the need for
physical tooling. A wide variety of active and passive materials are
.. read more
Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment
In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous
works have showed in detail,the characterization and modeling effort
.. read more
Applications of Semi-Additive Process Technology to PCB Design and Production
Traditional Subtractive Etch (SE) processes used to manufacture Printed Circuit Boards (PCBs) are adequate for many of today’s circuit designs. However, certain parts of PCBs, and more gener
.. read more
ULTRA HDI Printed Boards
This paper will discuss the evolution of the printed board design to date, how process improvements and new manufacturing technologies and chemistry have enabled the new step down in miniatu
.. read more
ULTRA HDI/SLP Production
This paper will discuss the difference between traditional advanced any layer HDI PCB with subtractive process and Ultra High-Density Interconnect (Ultra HDI) or substrate-like-PCB (SLP) wit
.. read more
Process Optimization for Fine Feature Solder Paste Dispensing
With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology,it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such
.. read more
Detailed Analysis of Impedance and Loss versus Frequency for Transmission Lines Made From Flexible Circuit Materials
With the emergence of high speed,controlled impedance circuits requiring increasingly tight tolerances,there is a realization among designers and fabricators that more precise data is needed th
.. read more
A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. read more
Electronics Manufacturing by Inkjet Printing
Inkjet printing is of great interest in the field of electronics manufacture because its digital nature negates the need for
physical tooling. A wide variety of active and passive materials are
.. read more
Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment
In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous
works have showed in detail,the characterization and modeling effort
.. read more