Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Temperature Cycling with Bending to Reproduce Typical Product Loads
In automotive applications, electronic products are subject to several loads, among which thermomechanical loads are particularly affecting the product reliability. Temperature cycling tests
.. read more
A Novel Approach to Evaluate the Impact on Solder Joint Reliability due to Multiple BGA Rework
PCB assemblies with numerous BGAs often go through multiple BGA reworks but there is not much data to suggest its effect
on the long term solder joint reliability of the BGAs. This study is foc
.. read more
Temperature Cycling with Bending to Reproduce Typical Product Loads
In automotive applications, electronic products are subject to several loads, among which thermomechanical loads are particularly affecting the product reliability. Temperature cycling tests
.. read more
A Novel Approach to Evaluate the Impact on Solder Joint Reliability due to Multiple BGA Rework
PCB assemblies with numerous BGAs often go through multiple BGA reworks but there is not much data to suggest its effect
on the long term solder joint reliability of the BGAs. This study is foc
.. read more