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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Fluxes Suppressing Non-Wet-Open at BGA Assembly
With the advancement in miniaturization, the die is getting thinner and the solder balls are getting smaller for BGAs. Consequently, the thermal warpage is getting more severe due to the mis
.. read more
Test Method Development for Detecting Pitting/Crevice Corrosion Formation on Electronic Assemblies
Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit
.. read more
Fluxes Suppressing Non-Wet-Open at BGA Assembly
With the advancement in miniaturization, the die is getting thinner and the solder balls are getting smaller for BGAs. Consequently, the thermal warpage is getting more severe due to the mis
.. read more
Test Method Development for Detecting Pitting/Crevice Corrosion Formation on Electronic Assemblies
Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit
.. read more