Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A System of Producing High-Powered RF Circuit Boards Employing a Low-CTE,Thermally Engineered Metalized Layer
The paper will propose to present a technology for the fabrication of Printed Circuit Boards (PCBs),used primarily in high-power RF/millimeter wave applications,which involves the use of a ther
.. read more
Via Hole Filling Technology for High Density,High Aspect Ratio Printed Wiring Boards Using a High Tg,low CTE Plugging Paste
The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and
.. read more
Novel Polyimide Build-up Material for Fine-line Fabrication
We have developed a new thermosetting polyimide build-up material for high performance build-up PWBs,which can mount
high speed CPUs with high I/O numbers. These PWBs meet the following require
.. read more
A System of Producing High-Powered RF Circuit Boards Employing a Low-CTE,Thermally Engineered Metalized Layer
The paper will propose to present a technology for the fabrication of Printed Circuit Boards (PCBs),used primarily in high-power RF/millimeter wave applications,which involves the use of a ther
.. read more
Via Hole Filling Technology for High Density,High Aspect Ratio Printed Wiring Boards Using a High Tg,low CTE Plugging Paste
The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and
.. read more
Novel Polyimide Build-up Material for Fine-line Fabrication
We have developed a new thermosetting polyimide build-up material for high performance build-up PWBs,which can mount
high speed CPUs with high I/O numbers. These PWBs meet the following require
.. read more