Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Acceptance Testing of Low-Ag Reflow Solder Alloys
Since the implementation of the European Union RoHS directive in 2006,the electronics industry has seen an expansion of available low-silver lead (Pb)-free alloys for wave soldering,miniwave re
.. read more
Reliability Study of Low Silver Alloy Solder Pastes
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased
.. read more
JEITA’s Standardization Activity of 2nd Generation Lead-Free Solder Paste
1.Obtain suggestions from the solder manufactures
Low-Ag SAC Paste
•Increase in reflow temp
•Impact on thermal fatigue and wetting
Sn-Bi low-temp Paste
•Impact on shock strength
•Creep fatigue
.. read more
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. read more
A Review of Issues and Next Steps in Moving From Sn3Ag0.5Cu to Low Silver Solder Alloys
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. read more
Low-Silver BGA Assembly Phase II – Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents. There are numerous perceived reliability benefits to
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Third Report: Comparison of Four Low-Silver Sphere Alloys and...
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more
Acceptance Testing of Low-Ag Reflow Solder Alloys
Since the implementation of the European Union RoHS directive in 2006,the electronics industry has seen an expansion of available low-silver lead (Pb)-free alloys for wave soldering,miniwave re
.. read more
Reliability Study of Low Silver Alloy Solder Pastes
Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased
.. read more
JEITA’s Standardization Activity of 2nd Generation Lead-Free Solder Paste
1.Obtain suggestions from the solder manufactures
Low-Ag SAC Paste
•Increase in reflow temp
•Impact on thermal fatigue and wetting
Sn-Bi low-temp Paste
•Impact on shock strength
•Creep fatigue
.. read more
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. read more
A Review of Issues and Next Steps in Moving From Sn3Ag0.5Cu to Low Silver Solder Alloys
The implementation of the European Restriction of Hazardous Substances (RoHS) Directive has initiated an electronics industry materials evolution. Printed wiring board laminate suppliers,compon
.. read more
Low-Silver BGA Assembly Phase II – Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results
Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents. There are numerous perceived reliability benefits to
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Third Report: Comparison of Four Low-Silver Sphere Alloys and...
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more