Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Optimising Solder Paste Volume for Low Temperature Reflow of BGA Packages
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower proc
.. read more
Low Temperature SMT Solder Evaluation
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional
.. read more
Low Temperature Soldering: Thermal Cycling Reliability Performance
The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. Eutectic Sn-Bi alloy is usu
.. read more
New-Generation, Low-TemperatureLead-Free Solder for SMT Assembly
Sn3Ag0.5Cu (SAC305)is the major solder alloy after RoHS was adopted by the European Union. Since its melting temperature is relatively higher than eutectic SnPb alloy, the peak reflow temper
.. read more
SMT Assembly of LGA Components and SMT Rework with Low Temperature Solder Alloy
Low Temperature Solder (LTS) is increasingly being used as a replacement for SAC305 solder alloy. Processing with LTS can reduce energy costs and impact on the environment while also reducin
.. read more
Lead-Free, Low-Temperature Solder Paste for Drop Shock Critical Applications
The 2017 International Electronics Manufacturing Initiatives (iNEMI) Board and Assembly Roadmap had forecast a 20% adoption rate of low-temperature solders (LTS) for board assembly by 2027.
.. read more
Evaluations onThe Mixing andReliability Testingof Tin-Bismuth Pastes withSnAgCu BGA Components andReliability Failure Analysis Comparing CT (Computed Tomography) Inspection andCross-Sectioning
Recently there has been an increase in the evaluation of low temperature lead-free soldering materials, such as tin-bismuth, in a process known as “hybrid assembly” in which higher temperatu
.. read more
Low Temperature Alloy Development for Electronics Assembly
New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance.
•Effect of these elemental additions on the new alloys was
.. read more
Optimising Solder Paste Volume for Low Temperature Reflow of BGA Packages
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower proc
.. read more
Low Temperature SMT Solder Evaluation
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional
.. read more
Low Temperature Soldering: Thermal Cycling Reliability Performance
The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. Eutectic Sn-Bi alloy is usu
.. read more
New-Generation, Low-TemperatureLead-Free Solder for SMT Assembly
Sn3Ag0.5Cu (SAC305)is the major solder alloy after RoHS was adopted by the European Union. Since its melting temperature is relatively higher than eutectic SnPb alloy, the peak reflow temper
.. read more
SMT Assembly of LGA Components and SMT Rework with Low Temperature Solder Alloy
Low Temperature Solder (LTS) is increasingly being used as a replacement for SAC305 solder alloy. Processing with LTS can reduce energy costs and impact on the environment while also reducin
.. read more
Lead-Free, Low-Temperature Solder Paste for Drop Shock Critical Applications
The 2017 International Electronics Manufacturing Initiatives (iNEMI) Board and Assembly Roadmap had forecast a 20% adoption rate of low-temperature solders (LTS) for board assembly by 2027.
.. read more
Evaluations onThe Mixing andReliability Testingof Tin-Bismuth Pastes withSnAgCu BGA Components andReliability Failure Analysis Comparing CT (Computed Tomography) Inspection andCross-Sectioning
Recently there has been an increase in the evaluation of low temperature lead-free soldering materials, such as tin-bismuth, in a process known as “hybrid assembly” in which higher temperatu
.. read more
Low Temperature Alloy Development for Electronics Assembly
New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance.
•Effect of these elemental additions on the new alloys was
.. read more