Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Low Temperature SMT Solder Evaluation
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional
.. read more
Surface Treatment Enabling Low Temperature Soldering to Aluminum
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular
.. read more
Low Temperature Soldering: Thermal Cycling Reliability Performance
The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. Eutectic Sn-Bi alloy is usu
.. read more
SMT Assembly of LGA Components and SMT Rework with Low Temperature Solder Alloy
Low Temperature Solder (LTS) is increasingly being used as a replacement for SAC305 solder alloy. Processing with LTS can reduce energy costs and impact on the environment while also reducin
.. read more
Anti-Slump SiP Solder Paste Enables Further Miniaturization
In this study, a patent-pending new solder paste material has been developed for assembly of System in Package (SiP) with outstanding slump resistance without compromising the paste volume p
.. read more
Selective Soldering with Alternative Lead-Free Alloys
The electronics industry is still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Alternative alloys
.. read more
Investigation of Low Temperature Solders to Reduce Reflow Temperature,Improve SMT Yields,and Realize Energy Savings
The miniaturization of electronic devices demands the continued shrinking of system z-height. A significant consequence of these ultra-thin systems is yield loss due to high temperature warpage
.. read more
Jet Printing of Low Temperature Solder Paste
•Jet printing introduction
•Industry challenges
•Jet printing low temperature paste
–Collaboration Alpha-MYDATA
–Rheology
–Results
•Low temperature paste offers a production solution for advanc
.. read more
An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. read more
Low Temperature SMT Solder Evaluation
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional
.. read more
Surface Treatment Enabling Low Temperature Soldering to Aluminum
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular
.. read more
Low Temperature Soldering: Thermal Cycling Reliability Performance
The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. Eutectic Sn-Bi alloy is usu
.. read more
SMT Assembly of LGA Components and SMT Rework with Low Temperature Solder Alloy
Low Temperature Solder (LTS) is increasingly being used as a replacement for SAC305 solder alloy. Processing with LTS can reduce energy costs and impact on the environment while also reducin
.. read more
Anti-Slump SiP Solder Paste Enables Further Miniaturization
In this study, a patent-pending new solder paste material has been developed for assembly of System in Package (SiP) with outstanding slump resistance without compromising the paste volume p
.. read more
Selective Soldering with Alternative Lead-Free Alloys
The electronics industry is still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Alternative alloys
.. read more
Investigation of Low Temperature Solders to Reduce Reflow Temperature,Improve SMT Yields,and Realize Energy Savings
The miniaturization of electronic devices demands the continued shrinking of system z-height. A significant consequence of these ultra-thin systems is yield loss due to high temperature warpage
.. read more
Jet Printing of Low Temperature Solder Paste
•Jet printing introduction
•Industry challenges
•Jet printing low temperature paste
–Collaboration Alpha-MYDATA
–Rheology
–Results
•Low temperature paste offers a production solution for advanc
.. read more
An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. read more