Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Elemental Compositions of Over Two Dozen Cell Phones
Twenty-nine different cells phones have been disassembled,ground up,dissolved and analyzed for elemental content,mainly for information about the metals present in the phones,but also for some
.. read more
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more
Elemental Compositions of Over Two Dozen Cell Phones
Twenty-nine different cells phones have been disassembled,ground up,dissolved and analyzed for elemental content,mainly for information about the metals present in the phones,but also for some
.. read more
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more