Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication
The ever expanding growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application. By optimizing the m
.. read more
Design and Fabrication of Thinner,Higher Speed Flexible Circuits
Modern flexible printed circuits demand improved signal integrity due to increasing data rate requirements for interconnects. At the same time,form factors available to designers are becoming s
.. read more
Characterizing the Lead-Free Impact on PCB Pad Craters
Pad cratering in Printed Circuit Boards (PCBs) is typically associated with lead-free products. This paper addresses laminate materials and the failures associated with the higher Pb-Free reflo
.. read more
High Frequency Conductor Loss Impact of Oxide and Oxide Alternative Processes
In most of today's high speed digital interconnects,the signal loss associated with the printed circuit board (PCB) is the
dominate factor. Material selection,trace geometry,and choice of coppe
.. read more
Design Considerations for Thin-Film Embedded Resistor and Capacitor Technologies
Embedded passives technologies can provide benefits of size,performance,cost,and reliability to high density,highspeed
designs. A number of embedded passive technology solutions are available t
.. read more
Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication
The ever expanding growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application. By optimizing the m
.. read more
Design and Fabrication of Thinner,Higher Speed Flexible Circuits
Modern flexible printed circuits demand improved signal integrity due to increasing data rate requirements for interconnects. At the same time,form factors available to designers are becoming s
.. read more
Characterizing the Lead-Free Impact on PCB Pad Craters
Pad cratering in Printed Circuit Boards (PCBs) is typically associated with lead-free products. This paper addresses laminate materials and the failures associated with the higher Pb-Free reflo
.. read more
High Frequency Conductor Loss Impact of Oxide and Oxide Alternative Processes
In most of today's high speed digital interconnects,the signal loss associated with the printed circuit board (PCB) is the
dominate factor. Material selection,trace geometry,and choice of coppe
.. read more
Design Considerations for Thin-Film Embedded Resistor and Capacitor Technologies
Embedded passives technologies can provide benefits of size,performance,cost,and reliability to high density,highspeed
designs. A number of embedded passive technology solutions are available t
.. read more