Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

Display

NanoCopper Based Solder-free Electronic Assembly Material

The Advanced Technology Center of the Lockheed Martin Corporation has developed a nanotechnology enabled copper-based electrical interconnect material that can be processed around 200 °C. The r .. read more

Properties that are Important in Lead-Free Solders

The change to lead-free solders has forced the electronics industry to consider more than it ever has before what properties are important in a solder. When the tin-lead eutectic was the only s .. read more

Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures

Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress .. read more

Lead-Free Implementation: Drop-In Manufacturing

The Lead-free electronics manufacturing has become a reality. As of this writing,a few manufacturers have rightfully reported their total completion to Lead-free production across all facilitie .. read more

NanoCopper Based Solder-free Electronic Assembly Material

The Advanced Technology Center of the Lockheed Martin Corporation has developed a nanotechnology enabled copper-based electrical interconnect material that can be processed around 200 °C. The r .. read more

Properties that are Important in Lead-Free Solders

The change to lead-free solders has forced the electronics industry to consider more than it ever has before what properties are important in a solder. When the tin-lead eutectic was the only s .. read more

Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures

Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress .. read more

Lead-Free Implementation: Drop-In Manufacturing

The Lead-free electronics manufacturing has become a reality. As of this writing,a few manufacturers have rightfully reported their total completion to Lead-free production across all facilitie .. read more