Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Development and Classification of Conductive Circuitry for E-textiles
This paper examines the development and classification of flexible and stretchable conductive pathways to carry power and data and details the technical challenges as well as the methodologi
.. read more
Board Level Reliability Testing of RF Packages
Board level reliability testing is becoming a requirement amongst users for acceptance of components and packages. Standard component level JEDEC tests are not sufficient to qualify a suppli
.. read more
Component Risk Mitigation Strategies
- COMPONENTS
- Risk Mitigation Testing Strategies Examples
- Risk Mitigation Testing Affiliations
- IDEA – 1010
- AS5553
- Mil-Std-1580
.. read more
FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints
This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl
.. read more
Development and Classification of Conductive Circuitry for E-textiles
This paper examines the development and classification of flexible and stretchable conductive pathways to carry power and data and details the technical challenges as well as the methodologi
.. read more
Board Level Reliability Testing of RF Packages
Board level reliability testing is becoming a requirement amongst users for acceptance of components and packages. Standard component level JEDEC tests are not sufficient to qualify a suppli
.. read more
Component Risk Mitigation Strategies
- COMPONENTS
- Risk Mitigation Testing Strategies Examples
- Risk Mitigation Testing Affiliations
- IDEA – 1010
- AS5553
- Mil-Std-1580
.. read more
FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints
This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl
.. read more