Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Non-Vacuum Process for Deposition of Thin Copper on Flexible Base Materials
The use of flexible circuit boards in the design and manufacture of electronic products has experienced a consistent and rapid growth over the last 15 years because their light weight and physi
.. read more
Design for Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Reliable Acid Copper Plating for Metallization of PCB
Copper plating is widely used in the electronic industry for fabrication of electronic devices. It is particularly useful for
fabrication of printed circuit boards and semiconductors. Copper is
.. read more
Direct Plating for Flex and Rigid-Flex Boards
In manufacturing flexible and rigid-flex boards,the metallization step using electroless copper poses a major challenge,namely the leaching of polyimide base material into the plating bath. Lea
.. read more
Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production
With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for
manufacturers and their suppliers to understand their impacts. The requirement to
.. read more
Advanced Packaging Using Liquid Crystalline Polymer (LCP) Substrates
Liquid crystalline polymer (LCP) substrates offer a number of advantages for high-density packaging. These properties include high temperature capability (>250oC),low coefficient of thermal exp
.. read more
A Non-Vacuum Process for Deposition of Thin Copper on Flexible Base Materials
The use of flexible circuit boards in the design and manufacture of electronic products has experienced a consistent and rapid growth over the last 15 years because their light weight and physi
.. read more
Design for Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Reliable Acid Copper Plating for Metallization of PCB
Copper plating is widely used in the electronic industry for fabrication of electronic devices. It is particularly useful for
fabrication of printed circuit boards and semiconductors. Copper is
.. read more
Direct Plating for Flex and Rigid-Flex Boards
In manufacturing flexible and rigid-flex boards,the metallization step using electroless copper poses a major challenge,namely the leaching of polyimide base material into the plating bath. Lea
.. read more
Desmear and Plating Through Hole Considerations and Experiences for Green PCB Production
With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for
manufacturers and their suppliers to understand their impacts. The requirement to
.. read more
Advanced Packaging Using Liquid Crystalline Polymer (LCP) Substrates
Liquid crystalline polymer (LCP) substrates offer a number of advantages for high-density packaging. These properties include high temperature capability (>250oC),low coefficient of thermal exp
.. read more