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Double Reflow-Induced Interfacial Failures in Pb-free Ball Grid Array Solder Joints

Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu .. read more

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

Accelerated temperature cycling was used to evaluate the thermal fatigue reliability for the case of backward compatible assembly (mixed alloy,Pb-free BGA/SnPb paste) of a 3162 pin count,extrem .. read more

Challenges in Reflow Profiling Large and High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes

Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec .. read more

Low Cost Optical Thickness Measurement of Conformal Coatings

Conformal coatings are used in high reliability electronics to protect the circuits from environmental contaminants. They are applied by a variety of methods,and in varying thicknesses. Confirm .. read more

Black Pad and Revisiting Methodologies

Society today relies on electronic devices that influence every aspect of our lives,such as communication,transportation,computing,home appliances,and recreation. The reliability of any electro .. read more

Liquid Tin Corrosion and Lead Free Wave Soldering

Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l .. read more

Double Reflow-Induced Interfacial Failures in Pb-free Ball Grid Array Solder Joints

Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu .. read more

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

Accelerated temperature cycling was used to evaluate the thermal fatigue reliability for the case of backward compatible assembly (mixed alloy,Pb-free BGA/SnPb paste) of a 3162 pin count,extrem .. read more

Challenges in Reflow Profiling Large and High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes

Backward Compatibility of Pb free SnAgCu (SAC) solders with conventional SnPb soldering has been a subject of considerable interest since the introduction of Pb free solders earlier in this dec .. read more

Low Cost Optical Thickness Measurement of Conformal Coatings

Conformal coatings are used in high reliability electronics to protect the circuits from environmental contaminants. They are applied by a variety of methods,and in varying thicknesses. Confirm .. read more

Black Pad and Revisiting Methodologies

Society today relies on electronic devices that influence every aspect of our lives,such as communication,transportation,computing,home appliances,and recreation. The reliability of any electro .. read more

Liquid Tin Corrosion and Lead Free Wave Soldering

Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l .. read more