Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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New High-Speed 3D Surface Imaging Technology in Electronics Manufacturing Applications
This paper introduces line confocal technology that was recently developed to characterize 3D features of various surface and material types at sub-micron resolution. It enables automatic micro
.. read more
Evaluating the Recess Depths of Recess-in-Motherboards using Different Metrologies
The demand to produce smaller electronic devices and products to meet the needs of consumer electronic applications has resulted in thinner ball grid array (BGA) packages with finer pitches. Du
.. read more
A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology
Signal integrity analysis has shown that printed circuit board (PCB) insertion loss is a key factor affecting high
speed channel performance. Determining and controlling PCB insertion loss have
.. read more
Effects of Adhesion Promotion Treatment On Electrical Signal Attenuation
Oxide alternatives,as well as traditional and reduced oxide chemistries,are coatings or “adhesion promoters” used to enhance the bond between imaged and etched inner layer copper surfaces and t
.. read more
BGA Solder Joint Mechanical Risk Assessment during System Level Shock Test
The pressure to reduce overall form-factor size in the high volume chassis desktop market is driving the need to integrate components at the system level. Adding to the challenge of size reduct
.. read more
Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures
Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress
.. read more
New High-Speed 3D Surface Imaging Technology in Electronics Manufacturing Applications
This paper introduces line confocal technology that was recently developed to characterize 3D features of various surface and material types at sub-micron resolution. It enables automatic micro
.. read more
Evaluating the Recess Depths of Recess-in-Motherboards using Different Metrologies
The demand to produce smaller electronic devices and products to meet the needs of consumer electronic applications has resulted in thinner ball grid array (BGA) packages with finer pitches. Du
.. read more
A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology
Signal integrity analysis has shown that printed circuit board (PCB) insertion loss is a key factor affecting high
speed channel performance. Determining and controlling PCB insertion loss have
.. read more
Effects of Adhesion Promotion Treatment On Electrical Signal Attenuation
Oxide alternatives,as well as traditional and reduced oxide chemistries,are coatings or “adhesion promoters” used to enhance the bond between imaged and etched inner layer copper surfaces and t
.. read more
BGA Solder Joint Mechanical Risk Assessment during System Level Shock Test
The pressure to reduce overall form-factor size in the high volume chassis desktop market is driving the need to integrate components at the system level. Adding to the challenge of size reduct
.. read more
Lead Free Assembly Impacts on Laminate Material Properties and “Pad Crater” Failures
Printed circuit board (PCB) feature sizes are decreasing to support increasing density thrusts for electronic products and packaging. The transition to lead-free products has changed the stress
.. read more