Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Rework and Reliability of High I/O Column Grid Array Assemblies
Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ
.. read more
Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World
The plated thru hole has changed considerably in 50 years of electronic packaging,but in its many forms remains the most
common interconnection in 1st and 2nd level electronic packaging,and is
.. read more
Rework and Reliability of High I/O Column Grid Array Assemblies
Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ
.. read more
Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World
The plated thru hole has changed considerably in 50 years of electronic packaging,but in its many forms remains the most
common interconnection in 1st and 2nd level electronic packaging,and is
.. read more