Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Assembly Reliability of TSOP/DFN PoP Stack Package
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-
.. read more
MICROSYSTEMS ENABLED PV
Microsystems Enabled PV:
•Technology benefits
•Process flow/assembly examples
•Cost analysis
•From R&D to commercialization
•3DIC/hybrid assembly and new functionality
.. read more
Assembly Reliability of TSOP/DFN PoP Stack Package
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-
.. read more
MICROSYSTEMS ENABLED PV
Microsystems Enabled PV:
•Technology benefits
•Process flow/assembly examples
•Cost analysis
•From R&D to commercialization
•3DIC/hybrid assembly and new functionality
.. read more